This paper presents a 3D-printed THz hemispherical lens antenna integrated with the open-ended rectangular waveguide at WR-10 band for antenna characteristics enhancement, e.g., gain and half-power beamwidth (HPBW). The digital light processing (DLP) technique, which is one of the famous 3D printing techniques, is chosen for fabricating the hemispherical lens antenna. The proposed design can be integrating the 3D-printed lens antenna without any extra assistant tools during assembly lensantenna with an open-ended WR-10 waveguide. In the simulation, the lens radiuses are investigated by varying from 2 mm to 5 mm in step with 1 mm. The optimum dimensions of the 3D-printed hemispherical lens antennas are obtained by using the 3D electromagnetic simulation tools. Based on the simulation results, at 90 GHz, the lens radiuses of 2 mm, 3 mm, 4 mm, 5 mm, and 6 mm, provide the maximum realized gain of 11.7 dBi, 13.1 dBi, 14.8 dBi, 15.8 dBi, and 16.3 dBi, respectively. The proposed technique gives many advantages, including ease of design, inexpensive material, low-cost fabrication process, rapid prototyping, etc. Moreover, the narrow HPBW and high gain of the proposed lens antenna can be applied to the 6G beamsteering frontend system.

Non-destructive thickness measurement offers a valuable feature for thin polymer-based applications in both industrial and medical utilization. Herein, we developed a novel, non-destructive, millimetre-wave WR-10 waveguide sensor for measuring a dielectric film layer on a transparent substrate. Complementary split-ring resonator (CSRR) was integrated on top of a customized WR10 waveguide and operated at 96 GHz. The thickness of the SU-8 layers, ranging from 3-13 m, coated on a glass substrate was then examined using the resonant frequency shift. The thickness values obtained from this novel sensor strongly resemble the values obtained from standard surface profiler measurement method, with less than 5 % difference. Thus, our novel design offers a comparable accuracy with a better cost effectiveness when compare with an existing commercial instrument.

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This paper presents a planar wideband bandpass filter using a combination of microstip structure and substrate integrated waveguide (SIW). To control the bandwidth of the wideband bandpass filter, the proposed filter is designed by cascading structure between the high pass filter and low pass filter characteristic. The SIW, which is a high pass filter characteristic, is designed to determine the lower cutoff frequency. Then, the microstrip, which is a and low pass filter characteristic, is designed to determine the higher cutoff frequency. To verify the concept of the proposed filter design, three wideband bandpass filters, e.g., 2-5 GHz, 3-5 GHz and 4-5 GHz, have been simulated and achieved, resulting in fractional bandwidth of 80%, 50% and 20%, respectively. To prove the simulated results, the 4-5 GHz wideband bandpass filter is selected to fabricate on the low-cost FR-4 substrate with a thickness of 1.6 mm. The results show that measured and simulated results are agreed well in the reflection and insertion responses.