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This paper reports on the fabrication of high aspect ratio silicon microelectrode arrays by micro-wire electrical discharge machining (l-WEDM). Arrays with 144 electrodes on a 400 lm pitch were machined on 6 and 10 mm thick p-type silicon wafers to a length of 5 and 9 mm, respectively. Machining parameters such as voltage and capacitance were varied for different wire types to maximize the machining rate and to obtain uniform electrodes. Finite element analysis was performed to investigate electrode shapes with reduced lateral rigidity. These compliant geometries were machined using l-WEDM followed by a two step chemical etching process to remove the recast layer and to reduce the cross sections of the electrodes.

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The purposes of this study were to develop and evaluate the test-retest reliability of a specific low-cost three-dimensional webcam recording system (3D-WCRS) and compare its reliability to a standard motion analysis system. Twenty healthy volunteers comprised of 5 males and 15 females with a mean age of 22.90 years and mean BMI of 22.72 kg/m 2 were investigated for angles of hip, knee and ankle joints in three planes while walking at a self-selected speed. Intraclass correlation coefficients (ICCs) were used to evaluate as well as compare the test-retest reliability of the 3D-WCRS and standard motion analysis system. Standard error of measurement (SEM) was also analyzed for the purposes of the study. The results exhibited excellent test-retest reliability for the 3D-WCRS (ICCs ranged between 0.93 and 0.99, p = 0.001) in the three joints and planes. The standard motion analysis system demonstrated excellent reliability for all joints and planes (ICCs ranged between 0.99 and 1.00, p = 0.001). Minimal SEM values were observed in both the 3D-WCRS and standard motion analysis systems. Therefore, the developed low-cost 3D-WCRS exhibits good to excellent test-retest reliability. The test-retest reliability of the 3D-WCRS is likely to be comparable to a standard motion analysis system.