Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

Rakwal, Dinesh; Heamawatanachai, Sumet; Tathireddy, Prashant; Solzbacher, Florian; Bamberg, Eberhard

doi:10.1007/s00542-009-0792-7

Cited by 32 publications

(10 citation statements)

References 16 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…Although it creates shafts 4 mm deep, this technology is limited to the number of shafts in the array (see table 1). Rakwal et al [24] introduced a fabrication process (μ-WEDM) capable of producing a 10 × 10 array with shaft lengths up to 9 mm. Although this sounds like a promising method, it is not standard industry technology.…”

Section: Discussionmentioning

confidence: 99%

“…Some efforts have been made to obtain 3D MEA with long electrodes based on silicon wafers micromachining which also include microwire electrical discharge machining [24] and self-assembled probes using a heat treatment processes [25] to achieve the final 3D array design. We have previously presented [26] an approach to fabricate 3D MEA with shaft lengths up to 3 mm, which use aluminum as the bulk material instead of silicon.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Fabrication and mechanical characterization of long and different penetrating length neural microelectrode arrays

Goncalves

Peixoto

Silva

et al. 2015

J. Micromech. Microeng.

View full text Add to dashboard Cite

This paper presents a detailed description of the design, fabrication and mechanical characterization of 3D microelectrode arrays (MEA) that comprise high aspect-ratio shafts and different penetrating lengths of electrodes (from 3 mm to 4 mm). The array's design relies only on a bulk silicon substrate dicing saw technology. The encapsulation process is accomplished by a medical epoxy resin and platinum is used as the transduction layer between the probe and neural tissue. The probe's mechanical behaviour can significantly affect the neural tissue during implantation time. Thus, we measured the MEA maximum insertion force in an agar gel phantom and a porcine cadaver brain. Successful 3D MEA were produced with shafts of 3 mm, 3.5 mm and 4 mm in length. At a speed of 180 mm min −1 , the MEA show maximum penetrating forces per electrode of 2.65 mN and 12.5 mN for agar and brain tissue, respectively. A simple and reproducible fabrication method was demonstrated, capable of producing longer penetrating shafts than previously reported arrays using the same fabrication technology. Furthermore, shafts with sharp tips were achieved in the fabrication process simply by using a V-shaped blade.

show abstract

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Fabrication and mechanical characterization of long and different penetrating length neural microelectrode arrays

Goncalves

Peixoto

Silva

et al. 2015

J. Micromech. Microeng.

View full text Add to dashboard Cite

show abstract

“…(C) 1000-channel close-packed silicon microelectrode fabricated combining electron beam and standard photolithography (Scholvin et al, 2016 ). (D) Multineedle electrode array fabricated with wire electron discharge machining allowing for non 3D needle-shaping (Rakwal et al, 2009 ). (E) All-silicon wire electrodes fabricated by combination of wet and dry etching processes (Pei et al, 2014 ).…”

Section: Micromachined Microelectrodesmentioning

confidence: 99%

“…Smoothening of roughness induced during dicing and WEDM in Utah electrode arrays (Rakwal et al, 2009 )…”

Section: Micromachined Microelectrodesmentioning

confidence: 99%

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

2017

View full text Add to dashboard Cite

Implantable neural interfaces for central nervous system research have been designed with wire, polymer, or micromachining technologies over the past 70 years. Research on biocompatible materials, ideal probe shapes, and insertion methods has resulted in building more and more capable neural interfaces. Although the trend is promising, the long-term reliability of such devices has not yet met the required criteria for chronic human application. The performance of neural interfaces in chronic settings often degrades due to foreign body response to the implant that is initiated by the surgical procedure, and related to the probe structure, and material properties used in fabricating the neural interface. In this review, we identify the key requirements for neural interfaces for intracortical recording, describe the three different types of probes—microwire, micromachined, and polymer-based probes; their materials, fabrication methods, and discuss their characteristics and related challenges.

show abstract

“…Out-of-plane fabrication techniques such as micro-wire electrical discharge machining [8], self-assembled probes using heat treatment [5], and magnetic processes [9] have also been used to produce 3D MEA. Yet, these techniques are not standard micromachining technology and limit the number of shafts in the array.…”

Section: Introductionmentioning

confidence: 99%

Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing

Goncalves

Oliveira

Peixoto

et al. 2015

Int J Adv Manuf Technol

View full text Add to dashboard Cite

This paper describes an optimized out-of-plane fabrication method for neural 3D high-aspect-ratio microelectrode array (MEA) based on a dicing technology platform (a standard procedure in semiconductor industry). The proposed MEA fabrication required important modifications in the dicing process. Since electrodes length reaches up to 4 mm, the main hindrance was the 2 mm cutting depth limit allowed for dicing machines with regular blades. This new procedure consisted on modifying Z-axis calibration, so cuts as deep as the exposure of blades were possible. The employment of proper blades for each fabrication step was also mandatory. Thin and high-exposure blades were used for deep cuts in silicon wafers, and V-shaped blades were employed to produce sharpened tips on the electrodes. Moreover, parameters as very low-cut speeds were essential to avoid wafer chipping and microcracks. Results showed high-precision and high-quality cuts in all steps of the 3D

show abstract

Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

Cited by 32 publications

References 16 publications

Fabrication and mechanical characterization of long and different penetrating length neural microelectrode arrays

Fabrication and mechanical characterization of long and different penetrating length neural microelectrode arrays

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

Out-of-plane neural microelectrode arrays fabrication using conventional blade dicing

Contact Info

Product

Resources

About