In spite of the recent heightened interest in molybdenum disulfide (MoS2) as a two-dimensional material with substantial bandgaps and reasonably high carrier mobility, a method for the layer-controlled and large-scale synthesis of high quality MoS2 films has not previously been established. Here, we demonstrate that layer-controlled and large-area CVD MoS2 films can be achieved by treating the surfaces of their bottom SiO2 substrates with the oxygen plasma process. Raman mapping, UV-Vis, and PL mapping are performed to show that mono, bi, and trilayer MoS2 films grown on the plasma treated substrates fully cover the centimeter scale substrates with a uniform thickness. Our TEM images also present the single crystalline nature of the monolayer MoS2 film and the formation of the layer-controlled bi- and tri-layer MoS2 films. Back-gated transistors fabricated on these MoS2 films are found to exhibit the high current on/off ratio of ∼10(6) and high mobility values of 3.6 cm(2) V(-1) s(-1) (monolayer), 8.2 cm(2) V(-1) s(-1) (bilayer), and 15.6 cm(2) V(-1) s(-1) (trilayer). Our results are expected to have a significant impact on further studies of the MoS2 growth mechanism as well as on the scaled layer-controlled production of high quality MoS2 films for a wide range of applications.

We fabricated dye-sensitized MoS2 photodetectors that utilized a single-layer MoS2 treated with rhodamine 6G (R6G) organic dye molecules (with an optical band gap of 2.38 eV or 521 nm). The proposed photodetector showed an enhanced performance with a broad spectral photoresponse and a high photoresponsivity compared with the properties of the pristine MoS2 photodetectors. The R6G dye molecules deposited onto the MoS2 layer increased the photocurrent by an order of magnitude due to charge transfer of the photoexcited electrons from the R6G molecules to the MoS2 layer. Importantly, the photodetection response extended to the infrared (λ < 980 nm, which corresponded to about half the energy band gap of MoS2), thereby distinguishing the device performance from that of a pristine MoS2 device, in which detection was only possible at wavelengths shorter than the band gap of MoS2, i.e., λ < 681 nm. The resulting device exhibited a maximum photoresponsivity of 1.17 AW(–1), a photodetectivity of 1.5 × 10(7) Jones, and a total effective quantum efficiency (EQE) of 280% at 520 nm. The device design described here presents a significant step toward high-performance 2D nanomaterial-based photodetector.

In spite of recent significant research into various two-dimensional (2D) materials after the emergence of graphene, the development of a new 2D material that provides both high mobility and an appropriate energy band gap (which are crucial for various device applications) remains elusive. In this report, we demonstrate that the carrier transport behaviour of 2D Ti2CTx, which belongs to the family of 2D transition metal carbides and nitrides, can be tuned by modifying the surface group Tx (-OH, -F, and -O). Our results show that 2D Ti2C(OH)xFy and Ti2COx films can be obtained via simple chemical treatment, thermal annealing, and mechanical exfoliation processes. For the first time, we study the carrier transport properties of 2D Ti2CTx field effect transistors (FETs), obtaining the high field effect carrier mobilities of 10(4) cm(2) V(-1) s(-1) at room temperature. The temperature dependent resistivity of the Ti2COx film exhibits semiconductor like Arrhenius behaviour at zero gate voltage, from which we estimate the energy gap of 80 meV. One interesting feature of the FETs based on transition metal carbides is that the field effect mobility at room temperature is less sensitive to the measured transport gaps, which may arise from the dominant charge transport of activated carriers over the narrow energy gaps of the transition metal carbides. Our results open up the possibility that new 2D materials with high mobilities and appropriate band gaps can be achieved, and broaden the range of electronic device applications of Ti2CTx films.

Despite heightened interest in 2D transition-metal dichalcogenide (TMD) doping methods for future layered semiconductor devices, most doping research is currently limited to molybdenum disulfide (MoS2), which is generally used for n-channel 2D transistors. In addition, previously reported TMD doping techniques result in only high-level doping concentrations (degenerate) in which TMD materials behave as near-metallic layers. Here, we demonstrate a controllable nondegenerate p-type doping (p-doping) technique on tungsten diselenide (WSe2) for p-channel 2D transistors by adjusting the concentration of octadecyltrichlorosilane (OTS). This p-doping phenomenon originates from the methyl (-CH3) functional groups in OTS, which exhibit a positive pole and consequently reduce the electron carrier density in WSe2. The controlled p-doping levels are between 2.1 × 10(11) and 5.2 × 10(11) cm(-2) in the nondegenerate regime, where the performance parameters of WSe2-based electronic and optoelectronic devices can be properly designed or optimized (threshold voltage↑, on-/off-currents↑, field-effect mobility↑, photoresponsivity↓, and detectivity↓ as the doping level increases). The p-doping effect provided by OTS is sustained in ambient air for a long time showing small changes in the device performance (18-34% loss of ΔVTH initially achieved by OTS doping for 60 h). Furthermore, performance degradation is almost completely recovered by additional thermal annealing at 120 °C. Through Raman spectroscopy and electrical/optical measurements, we have also confirmed that the OTS doping phenomenon is independent of the thickness of the WSe2 films. We expect that our controllable p-doping method will make it possible to successfully integrate future layered semiconductor devices.

We report the preparation of thickness-controlled few-layer black phosphorus (BP) films through the modulated plasma treatment of BP flakes. Not only does the plasma treatment control the thickness of the BP film, it also removes the chemical degradation of the exposed oxidized BP surface, which results in enhanced field-effect transistor (FET) performance. Our fabricated BP FETs were passivated with poly(methyl methacrylate) (PMMA) immediately after the plasma etching process. With these techniques, a high field-effect mobility was achieved, 1150 cm(2)/(V s), with an Ion/Ioff ratio of ∼10(5) at room temperature. Furthermore, a fabricated FET with plasma-treated few-layer BP that was passivated with PMMA was found to retain its I-V characteristics and thus to exhibit excellent environmental stability over several weeks.