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Spectral domain analysis techniques using roof-top functions as expansion functions for the surface current density have proofed to lead to a flexible tool for the calculation of arbitrarily shaped planar microwave structures. Several improvements of this method e.g. the introduction of new integration paths and analytic integration of a separated part of the dyadic function which reduce the computation time and which for the first time introduce losses (without using perturbation techniques) into the spectral domain analysis will be described. Furthermore the influence of surface waves and radiation is considered so that the transmission properties of planar microwave components can be described more realistically.

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A full-wave analysis method for the investigation of microstripand coplanar-structures including bond-wires, via-holes, gate-fingers and air-bridges is presented. For the first time spectral domain analysis technique is used to calculate the S-parameters of real three-dimensional metallization structures. The general formulation and the procedure of the method are described.

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