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Ellipsometry and atomic force microscopy (AFM) were used to study the film thickness of continuous and discontinuous polymer films in the 1-20 nm thickness range on smooth silicon wafers and on structured aluminium substrates. The methods of exploiting AFM for thickness measurements with a high spatial resolution are described.For continuous films, the AFM method is a direct one, i.e. it does not rely on any model. There is excellent agreement between AFM and ellipsometry in the 1-10 nm thickness range. Very small systematic deviations occur in this range but big deviations occur above 10 nm, and are discussed. The film preparation method, spin coating, was characterized to result in prepolymer films with a very homogeneous thickness.Discontinuous films of 2-9 nm thick were also evaluated by both methods of thickness determination. In tbis case, for one of the AFM approaches a model has to be used too. The agreement between both methods ranged from very good to poor, depending on the kind of sample and on the kind of AFM determination method.

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The birth and growth of ultrathin polymer films out of solution were studied by means of atomic force microscopy (AFM). The system investigated consisted of a model substance for a curable high-temperature adhesive (a prepolymer of the dicyanate of bisphenol A) and as received silicon wafers or aluminum evaporation coatings. The application techniques, dip-coating and spin-coating, allow film formation either in nearly equilibrated conditions or with the influence of centrifugal acceleration, respectively. AFM reveals significant differences between the films depending on the application technique and the substrate, but in some instances there are surprising similarities. The comparative interpretation of the findings results in the proposal of a model for the film formation of the investigated systems.

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