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The electro-mechanical impedance (EMI) technique employs surface-bonded lead zirconate titanate piezo-electric ceramic (PZT) patches as impedance transducers for structural health monitoring (SHM) and non-destructive evaluation (NDE). The patches are bonded to the monitored structures using finitely thick adhesive bond layer, which introduces shear lag effect, thus invariably influencing the electro-mechanical admittance signatures. This paper presents a new simplified impedance model to incorporate shear lag effect into electro-mechanical admittance formulations, both 1D and 2D. This provides a closed-form analytical solution of the inverse problem, i.e to derive the true structural impedance from the measured conductance and susceptance signatures, thus an improvement over the existing models. The influence of various parameters (associated with the bond layer) on admittance signatures is investigated using the proposed model and the results compared with existing models. The results show that the new

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