Abstract-The phosphor layer in phosphor-converted white Light Emitting Diodes (pcLEDs) affects their optical and thermal performances. This paper reports the effects of phosphor thickness and particle concentration on the optical efficiency and temperature rise on conformal phosphor-coated LED package. It is observed that a thicker phosphor layer and a higher phosphor particle concentration will increase the amount of backscattering and back reflection of light from the phosphor layer. These light extraction losses not only reduce the optical efficiency of the light output but also cause heat accumulation in the phosphor layer, leading to higher LED junction temperature. At 2700 K correlated colour temperature (CCT), the temperature rise is observed to increase by as much as 2.6 times as compared to its blue emitting LED package. However, the self-heating effect can be reduced through its die-bonding configuration. Structure function-based thermal evaluation shows heat accumulation in the phosphor layer and that flip-chip bonding can dissipate the heat generated in the GaN LED and phosphor layer effectively. Evidence in this study demonstrates that optical efficiency and thermal resistance of pcLEDs are dependent on the CCT ratings.

The phosphor and die bonding configuration affect the optical efficiency and thermal performance in phosphor-coated white light emitting diodes (LEDs). In this paper, light emission studies reveal that the chromaticity shift and light extraction losses depend on the uniformity of phosphor particles deposited over the LED surface. A nonuniform and sparse phosphor layer affects the correlated color temperature (CCT) and the spectral Y–B ratio due to the disproportionate contribution of light emission between the LED device and the phosphor layer. Furthermore, the Y–B ratio was observed to reduce with temperature due to higher Stoke's energy and light extraction losses in the phosphor layer. As a result, the Y–B ratio exhibits an inverse relationship with the package's thermal resistance as a function of temperature. On the other hand, the thermal performance of a LED package is dependent on the die-bonding configurations (conventional and flip-chip). Due to the improved heat dissipation capabilities in flip-chip bonding, the temperature rise and thermal resistance of the package were observed to reduce with temperature. By alleviating the heat accumulation in the package, more stable colorimetric properties such as CCT and Y–B ratio can be achieved.

The effect of relative humidity on LEDs and how the moisture incursion is associated to the color shift is studied. This paper proposes a different approach to describe the lumen degradation of LEDs due to the long-term effects of humidity. Using the lumen degradation data of different types of LEDs under varying conditions of relative humidity, a humidity based degradation model (HBDM) is developed. A practical estimation method from the degradation behaviour is proposed to quantitatively gauge the effect of moisture incursion by means of a humidity index. This index demonstrates a high correlation with the color shift indicated by the LED's yellow to blue output intensity ratio. Physical analyses of the LEDs provide a qualitative validation of the model, which provides good accuracy with longer periods of moisture exposure. The results demonstrate that the HBDM is an effective indicator to predict the extent of the long-term impact of humidity and associated relative color shift.

High-power Light Emitting Diode (LED) generates significant amount of heat fluxes that can affect the temperature-dependent properties of the device. This selfheating effect can upset the measurement setup and produce inaccurate readings, leading to misinterpretation of results such as electrical and thermal resistances. Optical, electrical and thermal performances of high-power LED packages were analysed under different temperature feedback controls. The results of these experiments demonstrate the importance of the temperature control module in the measurement setup affecting the device's properties such as the series resistance R s and the thermal resistance R th . In the electrical currentvoltage measurements, the temperature control module cannot control the self-heating effect effectively, resulting in a lower R s compared to when the measurements are made manually. In transient thermal measurements, it was found that lower R th values are obtained when the controller operates in closedloop adaptive temperature control compared to when it operates in open-loop adaptive temperature control. This paper recommends the manual electrical and open-loop thermal measurement methods for accurate parametric LED analyses.

LEDs are subjected to environments with high moisture in many applications. In this paper, the experiments reveal photometric and colorimetric degradation at high humidity. Corresponding spectral power analysis and parameter extraction indicate that the flip-chip bonded LED samples show accelerated chip failure compared to the conventionally bonded samples. The chip-related failure induces greater heat accumulation, which correlates with the increase in heating power observed in the package. However, the temperature rise and thermal resistance for the flip-chip bonded LEDs do not increase substantially as compared to the conventionally bonded LEDs. This is because the junction temperature can be reduced with a flip-chip die-bonding configuration where the heat generated in the LED chip is dissipated effectively onto the AlN substrate, thereby reducing the increase in temperature rise and thermal resistance. The experimental results are supported by evaluation of the derivative structure functions. In addition, as the thermal resistance of the LED package varies with different humidity levels, there is a need to specify the conditions of humidity in data sheets as LED manufacturers routinely specify a universal thermal resistance value under a fixed operating condition.