We demonstrate a simple route to depositing nickel layer patterns using photocross-linked polymer thin films containing palladium catalysts, which can be used as adhesive interlayers for fabrication of nickel patterns on glass and plastic substrates. Electroless nickel patterns can be obtained in three steps: (i) the pattern formation of partially quaterized poly(vinyl pyridine) by UV irradiation, (ii) the formation of macromolecular metal complex with palladium, and (iii) the nickel metallization using electroless plating bath. Metallization is site-selective and allows for a high resolution. And the resulting nickel layered structure shows good adhesion with glass and plastic substrates. The direct patterning of metallic layers onto insulating substrates indicates a great potential for fabricating micro/nano devices.

A polyester nonwoven textile with Ni-based alloy coating was fabricated, and the effect of electromagnetic wave shielding was evaluated. The Ni-based was coated by electroless plating on the textile. The electromagnetic wave shielding effect of the textile with Ni-B coating was about 99.98% over the induction range of 6-13 GHz. Because the textile has thin, light, flexible, and breathable characteristics, it will be versatile for the various electromagnetic wave shielding applications.Index Terms-Electroless palting, electromagnetic wave shielding, metallic magnetic material, Ni-based alloy, polyester nonwoven textile.

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A 1-octadecanethiol self-assembly monolayer (ODT-SAM) was formed on electroless Au/Ni-P layers to improve corrosion resistance. However, ethanolic solutions are inferior to aqueous solution in terms of safety and cost. For this study, ODT-SAMs were obtained from aqueous solutions. A nonionic surfactant was used to dissolve ODT in water. The adsorption of ODT was evaluated based on the contact angle of water. The corrosion resistance was evaluated using the salt spray test. The corrosion resistance of ODT-SAMs obtained by immersion for 300 s in an aqueous micellar solution of the surfactant concentration of at least 2.3 × 10-1 mol/L and the ODT concentration of 5.0 × 10-3 mol/L was equival ent to that of ODT-SAMs from ethanolic solutions. The formation status of the ODT-SAMs was examined using infrared reflection absorption spectroscopy. The structure of ODT-SAMs on a gold plated surface in an aqueous micellar solution was compared to that of ODT-SAMs on a gold plated surface in an ethanol solution, revealing no difference. No deterioration in bondability was observed when the solder-ball bondability and wire bondability of an Au/Ni-P substrate on which ODT-SAMs obtained from an aqueous micellar solution were formed. Results show that ODT-SAMs obtained from aqueous micellar solutions are useful as corrosion inhibitors for electroless Au/Ni-P layers used in printed wiring boards.

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