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Abstract-Recently, the first generation of mass production of FinFET-based microprocessors has begun, and scaling of FinFET transistors is ongoing. Traditional capacitance and resistance models cannot be applied to nonplanar-gate transistors like FinFETs. Although scaling of nanoscale FinFETs may alleviate electrostatic limitations, parasitic capacitances and resistances increase owing to the increasing proximity of the source/drain (S/D) region and metal contact. In this paper, we develop analytical models of parasitic components of FinFETs that employ the raised source/drain structure and metal contact. The accuracy of the proposed model is verified with the results of a 3-D field solver, Raphael. We also investigate the effects of layout changes on the parasitic components and the current-gain cutoff frequency (f T ). The optimal FinFET layout design for RF performance is predicted using the proposed analytical models. The proposed analytical model can be implemented as a compact model for accurate circuit simulations.Index Terms-Cutoff frequency, fin field-effect transistors (FinFETs), fringe capacitance, number of gate fingers, number of fins, parasitic resistance, radio frequency (RF).

In this paper, an analytical model for fringing gate capacitance in gate-all-around cylindrical silicon nanowire MOSFETs (SNWTs) is proposed. The fringing gate capacitances of the SNWT are divided into three parts: sidewall capacitance C side ; parallel capacitance Cgsd; perpendicular capacitance Cgex. Each capacitance is calculated using the following methods: conformal mapping, integral and non-dimensionalization. The proposed model is verified with a three-dimensional field solver, Raphael. Based on the proposed model, the fringing capacitance can be easily predicted in the vertically and horizontally stacked multi-wire SNWTs.

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In this paper, an analytical model is presented for the source/drain parasitic resistance of FinFET. The parasitic resistance is a important part of a total resistance in FinFET because of current flow through the narrow fin. The model incorporates the contribution of contact and spreading resistances considering three-dimensional current flow. The contact resistance is modeled taking into account the current flow and parallel connection of dividing parts. The spreading resistance is modeled by difference between wide and narrow and using integral. We show excellent agreement between our model and simulation which is conducted by Raphael, 3D numerical field solver. It is possible to improve the accuracy of compact model such as BSIM-CMG using the proposed model.