This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1-9), fabrication techniques (sections 10-12), and design and modeling
Copper nanowire (Cu NW)-based flexible transparent conductive electrodes (FTCEs) have been investigated in detail for use in various applications such as flexible touch screens, organic photovoltaics and organic light-emitting diodes. In this study, hexadecylamine (HDA) adsorbed onto the surface of NWs is changed into polyvinylpyrrolidone (PVP) via a ligand exchange process; the high-molecular-weight PVP enables high dispersion stability. Intense pulsed light (IPL) irradiation is used to remove organic species present on the surface of the NWs and to form direct connections between the NWs rapidly without any atmospheric control. NWs are self-nanoembedded into a plastic substrate after IPL irradiation, which results in a smooth surface, strong NW/substrate adhesion, excellent mechanical flexibility and enhanced oxidation stability. Moreover, Cu NW FTCEs with high uniformities are successfully fabricated on a large area (150 mm × 200 mm) via successive IPL irradiation that is synchronized with the motion of the sample stage. This study demonstrates the possibility of roll-to-roll-based, large-scale production of low-cost, high-performance Cu NW-based FTCEs.
Printed electronics uses converging technologies, such as printing, fine mechanics, nanotechnology, electronics and other new technologies. Consequently, printed electronics raises additional health and safety concerns to those experienced in the traditional printing industry. This study investigated two printed electronics workplaces based on a walk-through survey and personal and area sampling. All the printed electronics operations were conducted in a cleanroom. No indication of exposure to excess silver nanoparticles or carbon nanotubes (CNTs) was found. While the organic solvents were lower than current occupational exposure limits, there was a lack of engineering controls, such as local exhaust ventilation, correct enclosure and duct connections. There was also an insufficient quantity of personal protective equipment, and some organic solvents not described in the safety data sheets (SDSs) were detected in the air samples. Plus, the cleaning work, a major emissions operation, was not conducted within a hood, and the cleaning waste was not properly disposed of. Therefore, the present exposure assessment results from two printed electronics workplaces suggest that the printed electronics industry needs to take note of the occupational safety and health risks and hazards already established by the traditional printing industry, along with new risks and hazards originating from converging technologies such as nanotechnology.
This paper presents the design, fabrication, and performance test of a gap adjustable
piezoelectrically-actuated DoD(drop-on-demand) molten metal injector for application to the 3D
microstructure manufacturing or printed electronics. In the design process, we propose the gap
adjustable mechanism of the piezoelectrically-actuated inkjet system to control the volume and
velocity of the ejected molten metal droplets. In the experimental process, we fabricate the DoD
metal injector and measure the volumes and velocities of the ejected droplets for molten metal as
well as pure water to compare the ejecting performance for the different viscosity of ink and the
operating temperature of the system.
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