This paper proposes a novel multi-material 3D low-temperature co-fired ceramic base called NeuroStone. It employs 3D inkjet printing with ceramic and copper particle suspension, followed by cofiring. This technology provides both free-form and non-planar electrodes not only on the surface but also inside the device. NeuroStone makes it possible to enhance the directional freedom and electrode packing density in the field of miniature interconnection devices. This report demonstrates that the proposed technology can realize sophisticated shapes of interconnection devices fabricated by additive manufacturing, which can significantly enhance the scope of electronics.INDEX TERMS Additive manufacturing, ceramic device, direct print, printed electronics, three-dimensional electronics, three-dimensional printing.