In this work, an integration method of low profile probe array system is proposed for minimizing the tissue trauma after implantation. The planar neural probes was assembled with a Si platform to form a 3D probe array, which is then connected to the application-specific integrated circuit (ASIC) chip with a flexible polyimide cable by flip-chip bonding to complete the whole integration. The probe array and flexible polyimide cable have undergone electrical tests to prove to be highly stable and reliable. With the specially designed components, flexible assembly is achieved. The proposed integration method achieved a low profile of the probe array and the requirements for its applications. The impedance of the assembled probe electrode in artificial cerebrospinal fluid (aCSF) is measured to be about 1.1 MΩ at 1kHz.

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Traumatic brain injury (TBI) can be worsen by the secondary brain injury which will the major prognostic factor for the patient condition.The major parameters for monitoring the TBI are the intracranial pressure, partial brain oxygen level and the brain temperature. This leads to the development of an integrated intracranial microsystem which effectively monitored the condition of the TBI patient. This paper will present the biocompatible packaging and its in-vitro result for the microsytem.