Integration of low profile neural probe array with flexible polyimide cable

Ling, Tan Kwan; Cheng, M.; Giao, Teh Poh; Park, Woo-Tae; Je, Minkyu

doi:10.1109/eptc.2011.6184534

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…This paper presents a microassembly method of a lowprofile probe array for chronic implantation. 2D multielectrode probes [14] are fabricated and assembled into the slim Si platform [15,16] to implement a 3D probe array. As a Si lead transfer structure, a Si interposer is introduced to overcome the bonding plane mismatch between the probe array and the ASIC.…”

Section: Introductionmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

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This paper presents a microassembly method for low-profile three-dimensional probe arrays for neural prosthesis and neuroscience applications. A silicon (Si) lead transfer structure, Si interposer, is employed to form electrical connections between two orthogonal planes-the two dimensional probes and the dummy application-specific integrated circuit (ASIC) chip. In order to hold the probe array and facilitate the alignment of probes during assembly, a Si platform is designed to have through-substrate slots for the insertion of probes and cavities for holding the Si interposers. The electrical interconnections between the probes and the dummy ASIC chip are formed by solder reflow, resulting in greatly improved throughput in the proposed assembly method. Moreover, since the backbone of the probe can be embedded inside the cavity of the Si platform, the profile of the probe array above the cortical surface can be controlled within 750 μm. This low-profile allows the probe array not to touch the skull after it is implanted on the brain. The impedance of the assembled probe is also measured and discussed.

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Section: Introductionmentioning

confidence: 99%

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Cheng

Tan

et al. 2013

J. Micromech. Microeng.

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Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

2017

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Implantable neural interfaces for central nervous system research have been designed with wire, polymer, or micromachining technologies over the past 70 years. Research on biocompatible materials, ideal probe shapes, and insertion methods has resulted in building more and more capable neural interfaces. Although the trend is promising, the long-term reliability of such devices has not yet met the required criteria for chronic human application. The performance of neural interfaces in chronic settings often degrades due to foreign body response to the implant that is initiated by the surgical procedure, and related to the probe structure, and material properties used in fabricating the neural interface. In this review, we identify the key requirements for neural interfaces for intracortical recording, describe the three different types of probes—microwire, micromachined, and polymer-based probes; their materials, fabrication methods, and discuss their characteristics and related challenges.

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Integration of low profile neural probe array with flexible polyimide cable

Cited by 2 publications

References 9 publications

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

A low-profile three-dimensional neural probe array using a silicon lead transfer structure

Neural Interfaces for Intracortical Recording: Requirements, Fabrication Methods, and Characteristics

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