The influence of heat dissipation on the performances of organic light-emitting diode (OLED) is investigated by measuring junction temperature and by calculating the rate of heat flow. The calculated rate of heat flow reveals that the key factors include the thermal conductivity, the substrate thickness, and the UV glue. Moreover, the use of copper substrate can effectively dissipate the joule heat, which then reduces the temperature gradient. Finally, it is shown that the use of a high thermal conductivity thinner substrate can enhance the thermal conductivity of OLED and the luminance efficiency as well.

A non-scanning, non-interferometric, three-dimensional (3D) optical profilometer based on geometric optics, critical angle principle, and the use of a charge-coupled device (CCD) camera is presented. The surface profile of the test specimen can be transferred into the reflectance profile. The reflectance profile, obtained from a CCD, is the ratio of the intensity at the critical angle to the intensity obtained at the total internal reflection angle. The optical profilometer provides a sub-micron measuring range with nanometer resolution and can be used to measure roughness or surface defects in real time.

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