Abstract-In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger area than regular gates. In this paper, we address two critical aspects of TSV management in 3D designs. First, we address the problem of how many TSVs to add in a design. Since TSVs occupy significant silicon area, a general tendency has been to use a minimum number of TSVs in 3D circuits. We show that such an approach does not give us the best possible result. Second, we address the problem of TSV insertion. Because TSVs occupy silicon area, their location is decided during the placement stage of 3D design. However, we show that this is not the best possible stage for TSV insertion. We propose a change in the physical design flow for 3D integrated circuits to address the limitations of existing TSV placement methodology. All our algorithms are integrated with commercial tools, and our results are validated based on actual GDSII layouts. Our experimental results show the effectiveness of our methods.

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Radars form a central piece in a variety of emerging applications requiring higher degrees of localization. However, two problems are anticipated as more radars are deployed: viz., (i) inter-radar interference and (ii) security attacks. While many prior proposals have addressed the problems, no work in the radar literature addressed them simultaneously. In this context, we introduce a novel frequency-modulated continuous-wave (FMCW) radar scheme (namely, BlueFMCW) that aims to alleviate the damage from interference and active attacks (e.g., spoofing). The technique designs that the waveform randomly hops across multiple frequencies to dilute the damage at a certain frequency. Moreover, we propose a phase alignment algorithm to remove the phase discontinuity while combining the beat signals from the randomly-hopped chirps. The simulation results show that the proposed technique can efficiently mitigate the interference and spoofing signals in various scenarios without costing its resolution.

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