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Aluminum (Al) wire has certain limitations and cannot satisfy the increased demands for power electronics interconnects. Copper (Cu) wire has many benefits and is replacing Al wire in high power, high temperature applications. Cu wire is much harder and wears the bond tool much faster than Al wire. Consumable lifetime and process stability have to be improved so that Cu wire interconnect can be accepted for mass production. The bond tool wear mechanism is investigated. Bond process parameter, bond tool tip geometry, and bond tool material affect bond tool lifetime and bond performance. By combining the bond tool tip design and bond process optimization, an ultra-shallow groove bond tool that has a groove depth (GD) of 40% wire diameter achieved producing 260,000 Cu wire bonds. The groove opening angle (GOA) affects wire confine capability of a bond tool and a larger GOA is preferred for bond tools with a shallower GD. Alternative bond tool material shows benefits of improving bond appearance and further extending bond tool lifetime.