A novel inkjet technique for forming bus and address electrodes has been developed. Silver nano‐particles dispersed into organic solvent were employed as a special ink for inkjet printing. Bus electrodes of 50‐μm‐width and 2‐μm‐thickness have been inkjet printed using the nano‐particle ink. The resistivity of the bus electrodes was 2 μΩcm after baking at 300°C for 30 minutes. We have fabricated a PDP test panel using inkjet bus electrodes to study its feasibility.

Metal electrodes for low‐temperature polycrystalline‐silicon (LTPS) p‐channel thin‐film‐transistors (TFTs) have been fabricated employing an inkjet technique. This technique has the potential to reduce device fabrication costs and energy consumption during the device fabrication. We have developed a fine‐patterning technique employing the inkjet technique that is capable of producing metal lines with several μm widths by carefully controlling micro‐liquid behavior and surface wettability. TFTs employing the inkjet technique show good performance and reliability as same as conventional LTPS TFTs. These results show that the inkjet technique can be used to fabricate high‐performance LTPS TFTs at low cost.

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