Roll-to-roll ultraviolet (R2R-UV) imprinting is a low-cost and high-throughput method that includes the manufacturing of large-area functional films. However, the quality of the final product is obstructed by the bubble entrapment during the imprinting process. In this study, a multi-phase volume of fluid (VOF) numerical model was used to remove bubble entrapment during the R2R imprinting process, which covered all parameters. This new modified numerical model with open-channel boundary conditions was based on the single zone that contains the direct contact of UV resin with the imprinting mold during the filling process. In addition, this model simulated the UV resin filling into microcavities at the preceding and succeeding ends of the imprinting mold. Different patterns of imprinting mold were considered to enhance the fidelity of R2R-UV imprinting for the comprehensive analysis. The experimental results validated through numerical simulations revealed that the bubble entrapment can be controlled by varying various parameters such as speed of the imprinting system, viscosity, contact angles, and pattern shape. The proposed model may be useful for a continuous bubble-free R2R imprinting process in industrial applications that includes flexible displays and micro/nano-optics.

Nanofabrication of functional micro/nano-features is becoming increasingly relevant in various electronic, photonic, energy, and biological devices globally. The development of these devices with special characteristics originates from the integration of low-cost and high-quality micro/nano-features into 3D-designs. Great progress has been achieved in recent years for the fabrication of micro/nanostructured based devices by using different imprinting techniques. The key problems are designing techniques/approaches with adequate resolution and consistency with specific materials. By considering optical device fabrication on the large-scale as a context, we discussed the considerations involved in product fabrication processes compatibility, the feature’s functionality, and capability of bottom-up and top-down processes. This review summarizes the recent developments in these areas with an emphasis on established techniques for the micro/nano-fabrication of 3-dimensional structured devices on large-scale. Moreover, numerous potential applications and innovative products based on the large-scale are also demonstrated. Finally, prospects, challenges, and future directions for device fabrication are addressed precisely.

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Roll-to-roll nanoimprint lithography (RTR-NIL) is a low-cost and continuous fabrication process for large-area functional films. However, the partial ultraviolet (UV) resin filling obstructs the ongoing production process. This study incorporates UV resin filling process into the nanopillars and nanopores by using RTR-NIL. A multiphase numerical model with a sliding mesh method is proposed in this study to show the actual phenomena of imprint mold rotation and feeding of UV resin on the polyethylene terephthalate (PET) substrate. The implementation of UV resin filling under environmental conditions was performed by utilizing the open-channel (OC) boundary conditions. The numerical model was solved by using the explicit volume of fluid (VOF) scheme to compute the filling on each node of the computational domain. The effects of different processing parameters were investigated through the proposed numerical model such as imprinting speed (IS), contact angles (CAs), viscosity, initial thickness of the PET, and supporting roll diameter. A good agreement was found between numerical simulations and experimental results. The proposed numerical model gives better insights of the filling process for the mass production of functional surfaces with nanopillars and nanopores patterns for different applications on an industrial scale.

Data center servers located in thermal hotspot regions receive inlet air at a higher than theset temperature and thus generate comparatively high outlet temperature. Consequently, there is arise in energy that is consumed to cool down the servers that otherwise would undergo reliabilityhazards. The workload deployment across the servers should be resilient to thermal hotspots toensure smooth performance. In a heterogeneous data center environment, an equally importantfact is the placement of the servers in a thermal hotspot-aware manner to lower the peak outlettemperatures. These approaches can be applied proactively with the help of outlet temperatureprediction. This paper presents the hotspot adaptive workload deployment algorithm (HAWDA)and hotspot aware server relocation algorithm (HASRA) based on thermal profiling regarding outlettemperature prediction. HAWDA deploys workload on servers in a thermal-efficient manner andHASRA optimizes the server location in thermal hotspot regions to lower the peak outlet temperatures.Performance comparison is carried out to analyze the efficacy of HAWDA against the TASA andGRANITE algorithms. Results suggest that HAWDA provides average peak utilization of the serverssimilar to GRANITE and TASA without additional burden on the cooling mechanism, with andwithout server relocation, as HAWDA minimizes the peak outlet temperature.