Break junctions provide tip-shaped contact electrodes that are fundamental components of nano and molecular electronics. However, the fabrication of break junctions remains notoriously time-consuming and difficult to parallelize. Here we demonstrate true parallel fabrication of gold break junctions featuring sub-3 nm gaps on the wafer-scale, by relying on a novel self-breaking mechanism based on controlled crack formation in notched bridge structures. We achieve fabrication densities as high as 7 million junctions per cm2, with fabrication yields of around 7% for obtaining crack-defined break junctions with sub-3 nm gaps of fixed gap width that exhibit electron tunneling. We also form molecular junctions using dithiol-terminated oligo(phenylene ethynylene) (OPE3) to demonstrate the feasibility of our approach for electrical probing of molecules down to liquid helium temperatures. Our technology opens a whole new range of experimental opportunities for nano and molecular electronics applications, by enabling very large-scale fabrication of solid-state break junctions.

Achieving near-atomic-scale electronic nanogaps in a reliable and scalable manner will facilitate fundamental advances in molecular detection, plasmonics, and nanoelectronics. Here, a method is shown for realizing crack-defined nanogaps separating TiN electrodes, allowing parallel and scalable fabrication of arrays of sub-10 nm electronic nanogaps featuring individually defined gap widths.

The ability to manufacture a nanogap in between two electrodes has proven a powerful catalyst for scientific discoveries in nanoscience and molecular electronics. A wide range of bottom-up and top-down methodologies are now available to fabricate nanogaps that are less than 10 nm wide. However, most available techniques involve time-consuming serial processes that are not compatible with large-scale manufacturing of nanogap devices. The scalable manufacturing of sub-10 nm gaps remains a great technological challenge that currently hinders both experimental nanoscience and the prospects for commercial exploitation of nanogap devices. Here, available nanogap fabrication methodologies are reviewed and a detailed comparison of their merits is provided, with special focus on large-scale and reproducible manufacturing of nanogaps. The most promising approaches that could achieve a breakthrough in research and commercial applications are identified. Emerging scalable nanogap manufacturing methodologies will ultimately enable applications with high scientific and societal impact, including high-speed whole genome sequencing, electromechanical computing, and molecular electronics using nanogap electrodes.

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Bacterial adhesion on silicone nano-and microstructures is investigated in stagnant and flow experiments. Static adhesion tests are performed in 0.9% NaCl solution. These experiments reveal that the number of Staphylococcus epidermidis (S. epidermidis) and Escherichia coli (E. coli) adhering to glass surfaces can significantly be reduced if silicone nanofilament and rod coatings are present. Further, flow experiments are conducted in a parallel-plate flow chamber using 0.9% NaCl solution and artificial urine as medium. Silicone nanofilament coated surfaces are compared to uncoated glass surfaces. E. coli colonisation on filament coated surfaces is reduced for at least 24 h in 0.9% NaCl solution, while in artificial urine no reduction is observed after 24 h. S. epidermidis shows converse adhesion behaviour. Here, initial adhesion on nanofilaments is promoted but the number of adherent S. epidermidis seems to decrease after extended contact time. The obtained results demonstrate that superhydrophobic silicone surfaces significantly reduce bacterial colonisation under stagnant and dynamic conditions. However, the bacterial adhesion behaviour depends on the architecture of the silicone nano-and microstructures and the bacterial species investigated.