It is a known fact that no part of the earth surface is free from threat.It applies to Birbhum District, West Bengal, Indian Lateritic Terrain also. The existing terrain is characterized by mainly climatogenetic processes. Though the impact of climate change is vital in the shaping of the lesser topographies in the study-area. The study-area is characterized by micro landforms e. g. rills, gullies, water falls, terraces, gorges type features and limestone topographic type features. The denudational processes are very significant in the area in general but the differential erosion is evident in particular. It resembles the topographies with the African and the Brazillian Highlands. This paper interprets the rill and gully erosion risk in the lateritic terrain and their consequences in regional sustainable development and environmental management

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The continued demand for high performance electronic products and the simultaneous trend of miniaturization has raised the dissipated power and power densities to new unprecedented levels in electronic systems. Thermal management is becoming increasingly critical to the electronics industry to satisfy the increasing market demand for faster, smaller, lighter and more cost effective products. Utilization of waste heat for the purpose of cooling chip is a promising area for enhancing the thermal management and net energy efficiency of the system. This paper focuses on the development of a tubular microgrooved evaporator and its performance characterization based on heat transfer coefficients and pressure drop measurements. Channel with aspect ratio of 3:1 (channel width – 100 μm, channel height – 300 μm) microgrooved structure was used in the evaporator. The system has been tested with R134a as refrigerant for refrigerant flow rate range of 0.005–0.02 kg/s and water flow rate range of 0.25–0.65 kg/s. Very promising results has been obtained in preliminary investigation. Heat transfer coefficient as high as 13,500 W/m2k has been obtained which is almost five times higher than comparative state of art technologies. The associated pressure drop is quite modest and much less than state of the art conventional evaporators.

This paper investigates the effort to improve the reliability of a power module using physics-of-failure based approach. Thermal simulation of the power module board with the heat sink has been carried out and further these results have been used for estimating the overall thermal cycle reliability. Solder joint reliability has been investigated using two different kinds of solders ±SAC and Eutectic solder. It is seen that inductor components are failing early due to the delamination of the adhesive between ferrite surfaces. An experimental study is done to evaluate different kind of epoxy adhesives and to choose a suitable one. INTRODUCTIONHigher power density and better energy efficiency have lead to the widespread use of the solid state modules for the distribution and management of power in a wide range of applications. Use of these modules is dependent on ensuring the reliability in the intended application. In this paper, focus has been put on assessing the reliability of the solder joints in a 28 V power module system which contains various power components including planar magnetics, power capacitors and power switching devices using POF approach [1]. The overall reliability of the system is estimated using information about the use environment and the system design. To determine the extremes of the temperature condition to which the device is exposed, a thermal map of the board on the heat sink is prepared based on the power dissipation for the individual components. This result is then used for determining thermal cycle reliability of solder joints for both eutectic and SAC solder.

Degradation of lateritic environment as found in the south western and eastern Birbhum district can be FRQVLGHUHG DV LUUHVLVWLEOH ,QKHUHQWO\ SRRU SK\VLFDO DQG FKHPLFDO VWDWXV RI H[LVWLQJ ODWHULWLF VRLO SUR¿OH