In this paper we report an alternative sintering method for conductive silver tracks by UV radiation. The silver patterns have been obtained by inkjet printing from a commercially available silver nanoparticle ink. Different polymer materials such as polyimide, polycarbonate and liquid crystal polymer have been used as substrate materials. UVcuring resulted in highly conductive patterns with resistivities as low as four times that of bulk silver. The choice of substrate material has shown to greatly influence the achievable conductivity values. Furthermore it was demonstrated that UVsintering resulted in lower substrate temperature as compared to thermal sintering to get similar resistance values.

ZusammenfassungDigitale kontaktlose Drucktechnologien wie Inkjet oder Aerosol Jet

This paper summarizes the results on inkjet printing and characterization of functional structures on molded 2D and 3D devices. Different injection molded thermoplastics, a transfer molded thermoset and polyimide foil as substrate materials were used. Conductive structures were obtained by inkjet printing of a commercial available silver nanoparticle ink. The use of printable acrylic based ink enabled the fabrication of conductor crossovers or multilayers. Results on inkjet printed temperature sensitive structures and an inkjet printed intrusion sensor device as well as an inkjet printed electrical interconnect on a transfer molded package will be presented.

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