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SrBi 2 Ta 2 O 9 (SBT) ferroelectric thin films were prepared by metalorganic decomposition on Pt/Ti/SiO2/Si substrates at annealing temperatures ranging from 600 to 750 °C. The SBT thin films were annealed layer by layer during the spin-coating process using a rapid thermal annealing (RTA) furnace. The relative intensity of (200) peak in x-ray diffraction increased with the increase of the annealing temperature. A (200)-predominant film can be formed at 700 and 750 °C. For the film annealed by RTA furnace at 650 °C, the remanent polarization (2Pr) and coercive field (2Ec) were 19.8 μC/cm2 and 116 kV/cm, respectively.

Si 1−x Ge x were deposited by a radio frequency magnetron sputtering system and were furnace crystallized at a temperature of 550 °C. The crystallization process was characterized by x-ray diffraction (XRD), Raman spectra, electron spin resonance transmission electron microscopy. The effect of germanium content in the films was studied for samples with germanium from 19% to 53%. Doping of Si1−xGex films by phosphorous was investigated through measurement of sheet resistance and carrier mobility. It was found that sputtered Si1−xGex films can be useful for thin film transistors with low temperature budget. No significant clustering of pure Ge or Si in Si1−xGex films was deduced from the recorded XRD and Raman spectra.

H + was implanted into single-crystal silicon with a dose of 1×1016/cm2 and an energy of 30 KeV, and then He+ was implanted into the same sample with the same dose and an energy of 33 KeV. Both of the implantations were performed at room temperature. Subsequently, the samples were annealed in a temperature range from 200 to 450 °C for 1 h. Cross-sectional transmission electron microscopy, Rutherford backscattering spectrometry/channeling, elastic recoil detection, and high resolution x-ray diffraction were employed to characterize the strain, defects, and the distribution of H and He in the samples. The results showed that co-implantation of H and He decreases the total implantation dose, with which the surface could exfoliate during annealing. During annealing, the distribution of hydrogen did not change, but helium moved deeper and its distribution became sharper. At the same time, the maximum of the strain in the samples decreased a lot and also moved deeper. Furthermore, the defects introduced by ion implantation and annealing were characterized by slow positron annihilation spectroscopy, and two positron trap peaks were found. After annealing, the maximum of these two peaks decreased at the same time and their positions moved towards the surface. No bubbles or voids but cracks and platelets were observed by cross-sectional transmission electron microscopy. Finally, the relationship between the total implantation dose and the fraction of hydrogen in total implantation dose was calculated.

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