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A cooling system device, designated Heat Pipe (HP), is commonly used to transfer heat more efficiently than simply connecting cold and warm zones with high conductive metallic connections. These devices can reach an effective thermal conductance several hundred times more than the copper (401 W/(m 2 K) at 25°C) [Reay, D. 2006]. HPs are passive heat exchangers using liquid-gases phase changes in a closed loop to remove a considerable quantity of heat from evaporator region to condenser one, with capillary driven return flow (Figure 1b). The interest in the development of more efficient HP is constantly increasing. It is possible to adapt HP to specific application using different working fluids, materials and shapes. For instance titaniumalloy/nitrogen HP are used for cryogenic ranges (< 30 K); tungsten/silver HP can work at high temperature range (> 2300 K); in electronic cooling applications where the temperature must be maintain below 400 K, copper/water HPs are typically used [Gamer, S.D. 1996]. There are also different designs to control capillary flow as wick structures, porous media and micro-channels [Wang, C. Y. 1994]. More advanced studies have been made on the use of particular mixtures called Self-Rewetting [Savino, R. 2007] that increase the pumping effect of the wick capillarity thanks to the inverse Marangoni effect [Savino, R. 2006]. This effect can be modelled when using