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In this paper, we describe a study in which the thermal performance data of Theta jc (Rth-JC), Theta ja (Rth-JA), and structure functions of a flip-chip ball grid array device with heat spreader, fcBGA-H, was measured. For Rth-JC, various boundary conditions for the thermal resistance modeling were considered and are discussed here. A transient measurement method was used to obtain the temperature responses of the diodes. The structure functions of the diodes were measured; and the thermal resistances were calculated. Furthermore, the effect of power map on the structure functions was studied, and a thermal simulation was conducted to match the simulated structure functions with the experimental structure functions. The matched simulation structure functions provides the most accurate thermal resistor network for system level thermal evaluation.

In this paper, the thermal performance data of theta jc (Rth-JC) and theta ja (Rth-JA) of a flip chip ball grid array device with heat spreader, fcBGA-H, is measured. For Rth-JC, various boundary conditions for the thermal resistance modeling are considered and discussed. A transient measurement method is used to obtain the temperature responses of the diodes, as a function of time. The structure functions of the diodes are measured, and based on the structure functions, the thermal resistances are calculated. With the structure functions, the impact of package configurations are better viewed and demonstrated, and a novice measurement technique is also proposed here to measure the thermal resistance of junction to die, Rth-JD. With this experimental setup, there is no need to use the thermal couples. The traditional drilling hole for thermal couple and thermal couple itself will change the package configuration and heat dissipation path, and, therefore, impact the accuracy of the measurements.