2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2016
DOI: 10.1109/itherm.2016.7517736
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Temperature change induced degradation of SiC MOSFET devices

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Cited by 14 publications
(5 citation statements)
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“…The degraded SiC MOSFETs were inspected with non‐destructive analysis methods using the Scanning Acoustic Microscopy to detect internal defects such as voids, cracks, and delamination. Huge delamination was detected at the mould compound to the heat sink interface and also verified the increased thermal impedance [25]. Furthermore, the cross‐section image of the degraded SiC MOSFETs also showed a small crack was forming up at the tail of the bond wire attach, but no significant damage on the bond wire itself [25].…”
Section: Reliability Of Sic Mosfetsmentioning
confidence: 85%
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“…The degraded SiC MOSFETs were inspected with non‐destructive analysis methods using the Scanning Acoustic Microscopy to detect internal defects such as voids, cracks, and delamination. Huge delamination was detected at the mould compound to the heat sink interface and also verified the increased thermal impedance [25]. Furthermore, the cross‐section image of the degraded SiC MOSFETs also showed a small crack was forming up at the tail of the bond wire attach, but no significant damage on the bond wire itself [25].…”
Section: Reliability Of Sic Mosfetsmentioning
confidence: 85%
“…SiC MOSFETs show a significant degradation on threshold voltage, drain leakage current, and on-state resistance due to charge tunnelling into the gate oxide under repetitive SC stress, avalanche stress, and surge current stress [22][23][24]. The SiC MOSFET's package reliability was also investigated by power cycling test (PCT) and temperature cycling test in [25][26][27]. Despite these publications on various aspects of ruggedness and reliability of SiC MOSFETs under harsh conditions, there is not yet a survey or review paper available that comprehensively addresses the academic and industrial need to treat this important subject.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, CM methods based on V CE-on can accurately predict BWLO only if the estimated T j is verified in healthy mode from at least one other method which is not oriented to BWLO. An alternative method is based on an in-situ circuit connected to the power converter that measures both I C and V CE-on in real time, as proposed in [33,34]. The two measurements give the power losses that are used to estimate the temperature T j and, hence, infer the health condition of the bond wires.…”
Section: Methods To Detect Bwlomentioning
confidence: 99%
“…The dynamic load change of the DC/DC converter can affect the temperature change profile of the semiconductors. Continuous temperature changes of the semiconductors can shorten the lifetime of the semiconductors [40][41][42].…”
Section: Dc/dc Convertermentioning
confidence: 99%