Silver nanoparticles have drawn extensive attention as biomaterial components. Human fibroblasts were grown on various concentrations of silver nanoparticles during the period observation. Normal viability (0% silver particles) was increased from 6 to 72 hours, increasing the amount of human fibroblasts (1.5x10 4 to 7x10 6 cells/well) normally. Nevertheless, at higher concentrations of silver nanoparticles (50%) 1.11x10 5 cells/well remained after 72 hours. Results indicated that the increase in the concentration of silver nanoparticles reduced the number of fibroblasts and affected their fission. Silver nanoparticles were found under the membranes of fibroblast following dry treatment. The number of tissues declined because the silver nanoparticles interrupted the fission mechanism during their development in vivo.

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In situ real-time monitoring of profile evolution during plasma etching of mesoporous low-dielectric-constant SiO 2Patterning of fluorine-, hydrogen-, and carbon-containing SiO 2 -like low dielectric constant materials in highdensity fluorocarbon plasmas: Comparison with SiO 2 O 2 plasma ashing is commonly used to remove photoresist. The effect of O 2 plasma ashing on the porous organosilicate glass (CH 3 SiO 1.5 ) n , one of the spin-on materials, is investigated. O 2 plasma can oxidize the methyl groups in porous organosilicate glass ͑POSG͒, which leads to the formation of Si-OH groups. The hydrophilic Si-OH groups will induce moisture uptake so that electrical degradation will occur in POSG film. Pure hexamethyldisilazane ͑HMDS͒ vapor ͑100% HMDS͒ can react with the Si-OH groups in POSG film. It converts hydrophilic Si-OH groups into hydrophobic Si-O-Si(CH 3 ) 3 groups against moisture uptake. The leakage current density decreases by a factor of 2-3 and the dielectric constant decreases from 3.62 to 2.4 when O 2 plasma-damaged POSG undergoes HMDS treatment at 80°C for 15 min. Therefore, HMDS treatment is the effective technique to repair the electrical degradation to POSG film during photoresist stripping processing.

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