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Three metal-catalyzed vinyl addition copolymers derived from partially fluorinated norbornenes and tricyclononenes have been synthesized and evaluated for use in formulating photoresists for 157 nm lithography imaging. The transparency of these polymers at 157 nm, as measured by variable angle spectroscopic ellipsometry (VASE), is greatly improved over their nonfluorinated counterparts. The results of preliminary lithographic evaluations of resists formulated from these polymers alone and with the addition of several new fluorinated dissolution inhibitors are presented. Images as small as 70 nm have been printed in some formulations.

The goal or this work has been to study candidate fluorocarbon materials that might serve as platforms from which to design 157nm resists. A specific goal of the work has been to identify transparent candidate materials that might provide a polymer backbone and acceptable etch resistance. Several model compounds were synthesized and their vacuum UV spectra were measured in the gas phase.Substituted norbornane (bicyclo[2.2.1]heptane) was of significant interest in this regard because we had used this structure successfully in the design systems for 193nm exposure. Surprisingly, 2-monofluoronorbornane is unstable and undergoes spontaneous dehydrohalogenation upon exposure to glass in vacuo. However, 2,2-substitution with fluorine and with other electron withdrawing groups such as trifluoromethyl and even carbonyl groups gives norbornyl derivatives with greatly improved transparency at 157nm. These observations led to the design a variety of novel norbornenes that can be polymerized by metal catalyzed addition polymerization to give etch resistant polymer platforms with greatly improved transparency at 157nm and led to the study of acrylic co-polymers derived from 2-(trifluoromethyl)acrylic acid.

Many semiconductor device manufacturers plan to make products with 157 nm lithography beginning in 2004. There is, at this time, no functional photoresist suitable for 157 nm exposure. Developing resist materials for 157 nm lithography is particularly challenging since water, oxygen, and even polyethylene are strongly absorbing at this wavelength. A modular approach to the design of a single layer resist for 157 nm has been undertaken. In this approach, the resist has been conceptually segmented into four functional modules: an acidic group, an acid labile protecting group, an etch resistant moiety, and a polymer backbone. Each of these modules has an assigned function and each must be transparent at 157 nm. Progress has been made toward finding candidate structures for each of these modules. We have demonstrated that acidic bistrifluoromethylcarbinols are very transparent at 157 nm and function efficiently in chemically amplified resists with both high and low activation energy protecting groups. Judicious incorporation of fluorine in acrylates and alicyclics has provided etch resistant polymers with greatly improved transparency at 157 nm. In particular, esters of poly͑␣-trifluromethylacrylic acid͒ are far more transparent than their protio analogs. The Diels-Alder adducts derived from reaction of these and other fluorinated alkenes with cyclopentadiene offer a route to a wide range of alicyclic monomers that show great promise as transparent, etch resistant platforms for the design of 157 nm resists. Polymers of this sort with absorbance below 2 per micrometer are reported.