No abstract

This paper analyzes two failure cases of creep-caused fracture of PbSn solder joint, including the joint between the wire and solder cup in the connector and the joint between the integrated circuit (IC) pins and the printed circuit board (PCB). The environment conditions, for the creep of PbSn solder joint is demonstrated, including the temperature and stress level. The stress origin and fracture morphology are summarized based on the failure analysis. Besides, the developing process of creep-caused fracture is explained. The paper comprehensively clarifies the creep mechanism of PbSn solder and consequently provides significant guidance for the reliable electronic assembly to avoid the creep-caused damage.