This paper analyzes two failure cases of creep-caused fracture of PbSn solder joint, including the joint between the wire and solder cup in the connector and the joint between the integrated circuit (IC) pins and the printed circuit board (PCB). The environment conditions, for the creep of PbSn solder joint is demonstrated, including the temperature and stress level. The stress origin and fracture morphology are summarized based on the failure analysis. Besides, the developing process of creep-caused fracture is explained. The paper comprehensively clarifies the creep mechanism of PbSn solder and consequently provides significant guidance for the reliable electronic assembly to avoid the creep-caused damage.

Closed-form solutions for the elastic-plastic deformation and fracture responses of an offshore pipeline during reeling and unreeling operations are derived. As an example, an API 5L X52 pipeline of thickness 25.4 mm (1 in.) and outer diameter 406 mm (16 in.) bent over a drum radius of 16.5 m (54 ft) and then straightened back to its original configuration is considered. It was found that the pipeline underwent significant plastic deformation during bending and reverse bending. The plastic zone extended from the top (bottom) of the pipe to 16.46 mm above (below) the neutral axis during bending. Modified J-integral and JR resistance curves were compared to evaluate through-thickness crack growth and stability. The difference between predicted crack growth and experimental results varied from 30 to 140 percent. J-integral-based crack growth predictions were significantly lower and much closer to experimental results than previous predictions based on crack tip opening displacement. Finally, a failure assessment diagram (FAD) for the pipeline was presented. The FAD would enable one to assess the propensity to fracture in pipelines.