To improve the thermal and mechanical properties of liquid silicone rubber (LSR) for application, the graphene oxide (GO) was proposed to reinforce the LSR. The GO was functionalized with triethoxyvinylsilane (TEVS) by dehydration reaction to improve the dispersion and compatibility in the matrix. The structure of the functionalized graphene oxide (TEVS-GO) was evaluated by Thermogravimetric analysis (TGA), Fourier transform infrared (FTIR) spectra, X-ray diffraction (XRD), and energy dispersive Xray spectroscopy (EDX). It was found that the TEVS was successfully grafted on the surface of GO. The TEVS-GO/LSR composites were prepared via in situ polymerization. The structure of the composites was verified by FTIR, XRD, and scanning electron microscopy (SEM). The thermal properties of the composites were characterized by TGA and thermal conductivity. The results showed that the 10% weight loss temperature (T 10 ) increased 16.08C with only 0.3 wt % addition of TEVS-GO and the thermal conductivity possessed a two-fold increase, compared to the pure LSR. Furthermore, the mechanical properties were studied and results revealed that the TEVS-GO/LSR composites with 0.3 wt % TEVS-GO displayed a 2.3-fold increase in tensile strength, a 2.79-fold enhancement in tear strength, and a 1.97-fold reinforcement in shear strength compared with the neat LSR.

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Hollow microspheres (HM) of ceramic, silica, and glass‐filled silicone rubber (SR) composites were prepared, and the effects of hybrid HM on thermal and mechanical properties of composites were investigated. The results indicate that hybrid HM can effectively improve the thermal insulation property of HM/SR composites. Especially, for sample 15S, the thermal conductivity and thermal degradation temperature reached 0.1273 W/m K and 521 °C (45 °C higher than that of neat SR), respectively. Besides, thermal insulation performance was improved, showing as a temperature of 103.2 °C after 15 min heating, which is 37.8 °C lower than that of SR. The tensile strength of composites was enhanced from 1.92 MPa at 11.56 vol % hollow silica microspheres (HSM) loading to 3.08 MPa at 21.88 vol % HSM loading. Moreover, the compressive strength was improved from 3.33 to 5.68 MPa by introducing more hollow ceramic microspheres into the matrix, in this case, from 7.79 to 15.33 vol %. Furthermore, the failure mechanism was analyzed. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018, 135, 46025.

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