The development of resists that meet the requirements for resolution, line edge roughness and sensitivity remains one of the challenges for extreme ultraviolet (EUV) lithography. Two important processes that contribute to the lithographic performance of EUV resists involve the efficient decomposition of a photoacid generator (PAG) to yield a catalytic acid and the subsequent deprotection of the polymer in the resist film. We investigate these processes by monitoring the trends produced by specific masses outgassing from resists following EUV exposure and present our initial results. The resists tested are based on ESCAP polymer and either bis(4-tert-butylphenyl)iodonium perfluoro-1-butanesulfonate or bis(4-tert-butylphenyl)iodonium triflate. The components originating from the PAG were monitored at various EUV exposure doses while the deprotection of the polymer was monitored by baking the resist in vacuum and detecting the cleaved by-product from the polymer with an Extrel quadruple mass spectrometer.
We report the application of perylenetetracarboxylic diimide (PTCDI) nanowires for sensing ethyl acetate. The conductivity of the crystalline nano/microwires increases quickly and selectively in the presence of ethyl acetate vapor, but not with water, acid and alcohol vapors, suggesting that the nanowires of PTCDI may be used for monitoring ethyl acetate during a wine manufacturing process.
Optics contamination remains one of the challenges in extreme ultraviolet (EUV) lithography. In addition to the desired wavelength near 13.5 nm (EUV), plasma sources used in EUV exposure tools emit a wide range of out-of-band (OOB) wavelengths extending as far as the visible region. We present experimental results of contamination rates of EUV and OOB light using a Xe plasma source and filters. Employing heated carbon tape as a source of hydrocarbons, we have measured the wavelength dependence of carbon contamination on a Ru-capped mirror. These results are compared to contamination rates on TiO 2 and ZrO 2 capping layers.
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