In this paper, an intuitive approach to assessing advantages of beamforming in 5G wireless communication is proposed as a novel try and practical demonstration of importance of alignment between the transmitter’s and receiver’s beams working in millimeter-wave frequency bands. Since the diffraction loss of millimeter-wave signals matters seriously in propagation, the effects of the misalignment and alignment between beams need to be checked for, which was conducted with a horn antenna and the 4 × 4 Butler matrix which mimic the relationship of the base station and handset antennas. Designing and using the microstrip-line and the substrate integrated waveguide (SIW) Butler matrices, RF-to-RF wireless connectivity between the horn and the microstrip line beamformer as case 1 and the horn and the SIW beamformer as case 2, concerning the changing angle of the beam from either of the two Butler matrices, was tested, showing over 12 dB enhancement in received power. This direct electromagnetic link test was accompanied by examining 64-QAM constellations for beam-angle changing from −30° to +30° for the two cases, where the error vector magnitude in the QAM-diagram becomes less than 10% by beam-alignment for the changing angle.

In this paper, a new sensor is developed to estimate the dielectric constant of Cyclo Olefin Polymer (COP) film utilizable for 5G mobile phones’ multi-layered back−cover. It is featured by the electrical characterization of the thin layer of the COP film at 28 GHz as the material under test (MUT) directly contacting the planar probe (which is an array of resonating patches) and a new meta-surface as metal patterned on the COP film inserted between the planar probe and the 5G multi-layered back−cover for enhanced physical interpretation of the data by way of impedance matching. In this approach to delving into the material, a thin and small meta-surface film with an area of 25.65 × 21.06 mm2 and a thickness of 55 μm is examined for applications to 5G mobile 28 GHz-frequency communication on the basis of the below −10 dB-impedance matching for the 1-by-4 array sensor. Along with this, the real and commercial handset back−cover is brought to the test. The proposed method presents the advantages of geometrical adequacy to the realistic 5G handset antenna configuration, the idea of impedance-matching via meta-materials, and the suitability of characterizing the film-type structure as compared to the open-ended coaxial waveguide, waveguide-to-waveguide and TX horn-to-RX horn free-space test methods.

In this paper, a novel method is proposed to effectively reduce the size of a waveguide bandpass filter (BPF). Because the metallic cavities make the conventional waveguide end up with a large geometry, especially for high-order BPFs, very compact waveguide-type resonators having metamaterial zeroth-order resonance (WG ZOR) are designed on the cross section of the waveguide and substituted for the cavities. While the cavities are half-wavelength resonators, the WG ZOR is shorter than one-eighth of a wavelength. A substantial reduction in the size and weight of the waveguide filter is observed as the resonators are cascaded in series through coupling elements in the X-band that is much longer than that in K- or Ka-bands. The proposed metamaterial filter is realized as a 3D-printed structure to be lighter and thus more suitable for low earth orbit (LEO) satellites. An X-band of 7.25–7.75 GHz is chosen to verify the method as the passband with an attenuation of 40 dB at 7.00 GHz and 8.00 GHz as the roll-off in the stopband. The BPF is manufactured in two ways, namely the CNC-milling technique and metal coating–added 3D printing. The design is carried out with a geometrical parameter of not 10−2 mm but rather 10-1 mm, which is good for manufacturers but challenging for component designers. The measurement of the manufactured metal waveguide filters reveals that the passband has about ≤1 dB and ≤−15 dB as the insertion loss and the reflection coefficient, respectively, and the stopband has an attenuation of ≤−40 dB, which are in good agreement with the results of the circuit and the simulation. The proposed filter has a length of 14 cm as the eighth-order BPF, but the conventional waveguide is 20 cm as the seventh-order BPF for the same area of the cross section.

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In this paper, a novel chip antenna and its function in wireless connectivity are presented for Bluetooth (BLT) earphones. The chip antenna is a metamaterial so compact (<λ/8), as the size of 4.9 × 13.0 × 2.0 mm3, that when it is mounted on the realistic PCB, it can be held in the enclosure of the BLT earphone. This setting does not degrade the resonance (S11 < −10 dB) of the proposed antenna. As two earphones in a pair are demanded to communicate with each other, one shares an RF signal with the other and they take turns as the master and slave. The received signal sensing is conducted with the latest model of human head-ear-phantom located between the earphones to mimic the real use-case and cross-head interference. Electromagnetic simulation of the antenna is done and verified by fabrication and measurement. Particularly, received-signal strength indications between the proposed antennas in the earphones are experimentally obtained as −67.5 dBm and −70 dBm without and with the head-ear-phantom, respectively, much greater than −120 dBm, the limit of detection, and implying acceptable connectivity and invulnerability over cross-head-interference problems.