No abstract

Due to the rapid development of multifunctional and miniaturized electronic devices, the demand for polymer composites with mechanical properties, highthermal conductivity, and dielectric properties is increasing. Therefore, the heat dissipation capacity of the composite must be improved. To solve this problem, we report a glass fabric (GF)/boron nitride (BN) network with a highly thermally conductive hetero-structured formed using polyvinyl alcohol (PVA) as an adhesive. The GF and BN are furtherly modified by (3-aminopropyl)triethoxysilane (APTES) for better thermal conductivity enhancement. When the BN content is 30%, the thermal diffusion coefficient and thermal conductivity of obtained PVA-mBN@mGF (PBG) are 2.843 mm 2 /s and 1.394 W/(m K), respectively. Epoxy (EP) resin is then introduced to prepare PBG/mBN/EP laminated composites via the hot pressing method as applied as thermal conductive composites. A highest thermal conductivity of 0.67 W/(m K) of PBG/mBN/EP laminated composites is obtained, three times higher than that of pure EP. In addition, the PBG/mBN/EP laminated composites also present favorable mechanical, electrically insulating, and dielectric properties.

No abstract

Herein, carbon nanotubes (CNTs)–cellulose nanocrystals (CNCs)/ethylene‐vinyl acetate (EVA) composite are prepared with excellent bonding properties, electrical conductivity, and thermal conductivity using an ultrasonic‐assisted forced infiltration (UAFI) method. The CNTs–CNCs (10:1)/EVA composite had the highest shear (82.9 N) and strip (12.2 N) forces at the interface when bonding leather to fabric as an interface bonding material (IBM). Different mass ratios of CNTs to CNCs in the composites lead to different electrical and thermal conductivity properties. When the mass ratio of CNTs to CNCs is 10:1, the CNTs–CNCs(10:1)/EVA composites reach an electrical and thermal conductivity of 158.37 S m−1 and 6.351 W (m·K)−1, respectively. In addition, the CNTs–CNCs(10:1)/EVA composite shows excellent thermal stability, mechanical properties, thermal performance, and electromagnetic shielding. The prepared EVA composite has a broad application prospect in IBM.