Cloud computing bring a tremendous complexity to information security. Remote attestation can be used to establish trust relationship in cloud. TBVMM is designed to extend the existing chain of trust into the software layers to support dynamic remote attestation for cloud computing. TBVMM uses Bayesian network and Kalman filter to solve the dynamicity of the trusted relationship. It is proposed to fill the trust gap between the infrastructure and upper software stacks.

We review the current typical materials of microfluidic chip and discuss the microfabrication technologies. A variety of materials exist for fabrication of microchip, including silicon, glass, quartz, polymers and paper. Early developments in microchip materials were focus on the silicon, glass and quartz by referring to the sophisticated microfabrication techniques from microelectronics field. Recently, the introductions of low-cost materials and easily fabricated techniques have offered more alternative ways for rapid prototyping of disposable devices.

The electrical resistivity of metal fiber-filled polymer composite always increases during injection molding process because the conductive fibers were easily broken down to shorter under the action of high shear stress. In order to decrease electrical resistivity of the molding, we investigated the microstructure at different layers within the molding made from stainless steel fiber-filled polypropylene and measured their resistivities. High resistive zone mediate resistive zone and low resistive zone were found within the molding. The results showed that the high resistivity zone located at the skin area of the molding where average length of filled fibers was less than other zones, and the smallest resistive zone located at the core area where most fibers preserved large ratio of length to diameter and oriented along flowing direction of the melt, and the sub-skin zone is mediate resistive zone.

Strain clamp is an important connection device in guy tower. If the quality of the compression splicing position is unsatisfied, strain clamp tends to be damaged which may lead to the final collapse of a guy tower as well as huge economic lost. In this paper, stress distribution on the compressible tube and guy cable is analyzed by FEM, and a large equivalent stress of guy cable is applied to the compression splicing position. During this process, a finite element model of strain clamp is established for guy cables at compression splicing position, problems of elastic-plastic and contracting are studied and the whole compressing process of compressible position is simulated. The guy cable cracks easily at the position of compressible tube’s port, the inner part of the compressible tube has a larger equivalent stress than outside.