This paper explores stress management in SiGe with two kinds of structures, namely, epitaxial SiGe films on small pillars and fins. In addition to the compliant substrate effect in the film/fin structures, the geometric effect in the film/pillar structures plays another important role in critical thickness enhancement. The stress-strain states of these two systems are calculated and the equilibrium critical thicknesses are predicted, using the work method, for different fin thicknesses, pillar radii, and Ge concentrations. Compared to conventional films grown on planar bulk substrates, the critical thicknesses for fin and pillar structures are increased significantly. SiGe films with various thicknesses and compositions were epitaxially grown around vertical fins and horizontal membranes with thicknesses as thin as 12nm to demonstrate the concepts. Cross-sectional transmission electron microscopy analysis showed that dislocation densities are much smaller than for films grown on bulk Si substrates. The dislocation density versus fin thickness also illustrated the expected trend.

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This paper presents a novel CMOS-compatible negative differential resistance (NDR) device based on SiGe gated diodes. Experimental results on various prototypes show that this device has very high peak currents and the highest reported peak-to-valley current ratios in SiGe systems to date. This NDR element can be easily integrated into a normal 1T1C DRAM cell to enable an SRAM-like operation with a much more compact cell size.

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