In this paper, we describe the influence of 700 °C vacuum annealing on strength and fracture behavior of micro- and nano-scale Si structures fabricated by focused ion beam (FIB). Si nanowires (NWs) made from silicon-on-nothing (SON) membrane are fabricated using FIB. Microscale Si specimens are fabricated by conventional micromachining technologies and FIB. These specimens are tensioned to failure using specially developed microelectromechanical systems (MEMS) device and thin-film tensile tester, respectively. The mean fracture strengths of the nano- and microscale specimens are 5.6 and 1.6 GPa, respectively, which decrease to 2.9 and 0.9 GPa after vacuum annealing at 700 °C for only 10 s. These strength values do not vary with increasing annealing time. Fracture origin and its behavior are discussed in the light of fracture surface and FIB damage layer observations.

We describe the stress analysis of silicon oxide (SiO2) thin film using cathodoluminescence (CL) spectroscopy and discuss its availability in this paper. To directly measure the CL spectra of the film under uniaxial tensile stresses, specially developed uniaxial tensile test equipment is used in a scanning electron microscope (SEM) equipped with a CL system. As tensile stress increases, the peak position and intensity proportionally increase. This indicates that CL spectroscopy is available as a stress measurement tool for SiO2 film. However, the electron beam (EB) irradiation time influences the intensity and full width at half maximum (FWHM), which implies that some damage originating from EB irradiation accumulates in the film. The analyses using Raman spectroscopy and transmission electron microscopy (TEM) demonstrate that EB irradiation for stress measurement with CL induces the formation of silicon (Si) nanocrystals into SiO2 film, indicating that CL stress analysis of the film is not nondestructive, but destructive inspection.

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