This paper presents a silicon-micromachined microstrip antenna in which both feeding power and ground interconnection are performed along the vertical direction of the substrate at the wafer level. The antenna has a stacked structure consisting of a patch antenna substrate and a feed substrate. The structure possesses the following novel points: (i) it satisfies both optimum design and ease of wafer handling in the fabrication process; (ii) the ground plane intervened in the microstrip antenna is interconnected by through-wafer vias. The measured radiation patterns of the developed antenna at an 80-GHz band showed good agreement with the designed patterns. This newly developed technology can be utilized for wafer-level stacking to achieve a compact array antenna in the millimeterwave range.
In this letter, a neural network-based interelement phase estimation method using radiation power pattern of the linear phased array is proposed. To validate the proposed method, a radiation pattern measured in an anechoic chamber is input to the neural network to estimate the initial phase errors, and to confirm practical estimation accuracy. The proposed method requires only single radiation pattern measurement and no additional measurements only for estimation. This indicates the proposed method is significantly more time-saving, compared to other conventional techniques. Furthermore, we propose a method to suppress the failure rate of estimation by recursively reinputting patterns into the neural network, and discuss its effectiveness. These results show that the proposed methods useful for phase estimation of the linear array in experiments.
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