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Thermal stabilities of indium tin oxide (ITO) substrates and TiO 2 /ITO structures were evaluated in relation to their electrical properties. The ITO substrates and TiO 2 /ITO structures were annealed at 350, 400, and 500 8C. The ITO substrate with large grain size showed higher thermal stability than that with small grain size. The thermal stability of TiO 2 / ITO structure improved with increasing TiO 2 thickness, and a decrease in electron concentration was observed in resistance-increased samples. These changes were attributed to variations in grain-boundary potential caused by oxygen adsorption. It may be concluded that variation of the grain-boundary potential by thermal annealing has a dominant influence on resistance. Therefore, optimization of the grain size is important to improve the thermal stability of ITO. This mechanism and procedure can be applied to improve the characteristics of other TCO materials.

We have carried out an experiment on the free7ing aqueous solution flow of wi 冂ter fiounder alltifreeze protein in a micro − channel of O ． 15mln in height ，1． 2mm in width and 21mm in length ． An eleetro ・ osmotic pulnp was used to create the flow ofthe solution in dユe channel ． The flow was cooled from the side walt ． An ice ！ solution interface is observed at low magnification in a high − resolution bie ［ ogical microscope ． It is 正 bund from our experiment that， as the flow rate incrcases ， the growing rate orthe ice 〆 so］ution interface decreases and the intcrface becomes more serrated ． This is because the interaction between the interface and the protein ， continuously approaching the interface due to the flow ． occurs morc fi ' equently with an increase in the flow rate ． Key Mords ：Antifreeze protein ， ［ ce crystal gro 帆 h， Serrated interface ， Micro − channel flow

Experiments have been conducted into the unidirectional freezing of an aqueous solution of winter flounder antifreeze protein 0.02mm thick. It is confirmed that the instantaneous temperature field can be measured with a near-infrared camera. It is found that the difference between the conduction heat flux of pure water near the interface and that of ice is approximately equal to the heat flux for solidification, which is the product of ice density, interface velocity and the latent heat of fusion. The sum of the conduction heat flux of protein solution near the front edge of the serrated interface and the heat flux for solidification is approximately equal to the conduction heat flux of ice. On the other hand, the sum of the conduction heat flux of protein solution near the bottom edge of the serrated interface and the heat flux for solidification is much higher than the conduction heat flux of ice.