The recrystallization behaviour during annealing of cold-rolled Cu–5Fe–2Sn alloy was clarified in this paper. The effects of annealing temperature and time on the microstructure and properties of the Cu–5Fe–2Sn alloy were investigated. The equations of electrical conductivity and recrystallization kinetics during annealing were obtained with Martition's rule and Avrami empirical formula. The variations of recrystallization volume fraction and the growth of recrystallization grain for Cu–5Fe–2Sn alloy after 40% cold rolling were discussed. The calculated conductivity and volume fraction of recrystallization have a good match with experimental results. The variations of the properties of annealed Cu–5Fe–2Sn alloy are attributed to the growth rate of recrystallization phase and the size of recrystallization grains.

The growth and congregation of minor phase in immiscible Cu-Fe alloys were investigated. Results showed that the Brown motion was strongly affected by the initial number of the separated droplets. With the increase of initial numbers of droplets, the time needed for completing the Brown congregation reduced. The calculation confirmed that increasing the radiuses of droplets would lead to the decrease of the time for congregation completed. As the increases of the undercooling and the droplet radius, the ratio of Stokes motion velocity to Marangoni motion velocity increased.