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The heat dissipation through interchip structures was investigated by introducing 4-partition and 16-partition ceramic interchip structures for a 16-chip light-emitting diode (LED) package. Using the finite volume method simulation with ICEPAK V13.0, the temperature distribution inside the LED package and the junction temperature were estimated, from which the effect of the interchip structures on the heat dissipation characteristics of the LED package was investigated. The results showed that the ceramic interchip structures provided a more effective upward heat dissipation path for the LED package and contributed to a 23 • C decrease in the junction temperature for the 4-partition interchip structure and a 51 • C decrease for the 16-partition interchip structure at the 16 W operation.

The paper researches the reliability of HB‐LED by investigating thermal stress and thermo‐mechanical stress through FEM software. After verifying the accuracy of simulation model by steady state measurement, thermo‐mechanical stress would be simulated to investigate the failure mechanism of HB‐LED at low temperature.