Wearable thermoelectric generators can harvest heat from the human body to power an intelligent electronic device, which plays an important role in wearable electronics. However, due to the complexity of human skin, there is still no unified standard for performance testing of wearable thermoelectric generators under wearable conditions. Herein, a test platform suitable for a wearable thermoelectric generator was designed and built by simulating the structure of the arm. Based on the biological body temperature regulation function, water flow and water temperature substitute blood flow and blood temperature, the silicone gel with some thickness simulates the skin layer of the human arm, thus achieving the goal of adjusting the thermal resistance of human skin. Meanwhile, the weight is used as the contact pressure to further ensure the reliability and accuracy of the test data. In addition, the environment regulatory system is set up to simulate the outdoor day. Actually, the maximum deviation of the performance of the thermoelectric generator worn on the test platform and human arm is ∼5.2%, indicating the accuracy of objective evaluation.

Wearable thermoelectric generators (w-TEGs) convert thermal energy into electrical energy to realize self-powering of intelligent electronic devices, thus reducing the burden of battery replacement and charging, and improving the usage time and efficiency of electronic devices. Through finite element simulation, this study successfully designed high-performance thermoelectric generator and made it into wearable thermoelectric module by adopting “rigid device—flexible connection” method. It was found that higher convective heat transfer coefficient (h) on cold-end leads to larger effective temperature difference (ΔTeff) and better power generation performance of device in typical wearable scenario. Meanwhile, at same h on the cold-end, longer TE leg length leads to larger ΔTeff established at both ends of device, larger device output power (Pout) and open-circuit voltage (Uoc). However, when the h increases to a certain level, optimization effect of increasing TE leg length on device power generation performance will gradually diminish. For devices with fixed temperature difference between two ends, longer TE leg length leads to higher resistance of TEGs, resulting in lower device Pout but slight increase in Uoc. Finally, sixteen 16 × 4 × 2 mm2 TEGs (L = 1.38 mm, W = 0.6 mm) and two modules were fabricated and tested. At hot end temperature Th = 33 °C and cold end temperature Tc = 30 °C, the actual maximum Pout of the TEG was about 0.2 mW, and the actual maximum Pout of the TEG module was about 1.602 mW, which is highly consistent with the simulated value. This work brings great convenience to research and development of wearable thermoelectric modules and provides new, environmentally friendly and efficient power solution for wearable devices.

Air conditioning has become a necessity in people’s daily life. The performance of the compressor determines the energy efficiency ratio of this electrical equipment, but the heat generated during the operation of its internal core power components will greatly limit its performance release, so it is urgent to carry out research on the heat dissipation of power devices. In this work, we explore the application of thermoelectric coolers (TECs) in the field of power device heat dissipation through finite element simulation. First, we geometrically modeled the structure and typical operating conditions of core power devices in air conditioners. We compared the temperature fields in air-cooling and TEC active cooling modes for high-power-consumption power devices in a 319 K operating environment. The simulation results show that in the single air-cooling mode, the maximum temperature of the 173.8 W power device reached 394.4 K, and the average temperature reached 373.9 K, which exceeds its rated operating temperature of 368.1 K. However, the maximum and average temperature of the power device dropped to 331.8 K and 326.5 K, respectively, at an operating current of 7.5 A after adding TECs, which indicates that TEC active cooling has a significant effect on the temperature control of the power device. Furthermore, we studied the effect of the TEC working current on the temperature control effect of power devices to better understand the reliability of the TECs. The results show that TECs have a minimum working current of 5 A, which means it has no significant cooling effect when the working current is less than 5 A, and when increasing the current to 10 A, the average temperature of the power device can be reduced to 292.9 K. This study provides a meaningful exploration of the application of TECs in chip temperature control and heat dissipation, providing a new solution for chip thermal management and accurate temperature control.

This research aims to investigate the synergistic reinforcing mechanisms of chemically combined graphene oxide and nanosilica (GO-NS) in the structure of calcium silicate hydrate (C-S-H) gels compared with physically combined GO/NS. The results confirmed that the NS chemically deposited on the GO surface formed a coating to keep GO from aggregation, while the connection between GO and NS in GO/NS was too weak to prevent GO from clumping, making GO-NS better dispersed than GO/NS in pore solution. When applied to cement composites, the incorporation of GO-NS enhanced the compressive strength by 27.3% after 1-day hydration compared to that of the plain sample. This is because that GO-NS generated multiple nucleation sites at early hydration, reduced the orientation index of calcium hydroxide (CH), and increased the polymerization degree of C-S-H gels. GO-NS acted as the platforms for the growing process of C-S-H, enhancing its interface bonding strength with C-S-H and increasing the connection degree of the silica chain. Furthermore, the well-dispersed GO-NS was prone to insert in C-S-H and induced deeper cross-linking, thereby refining the microstructure of C-S-H. All these effects on hydration products resulted in the mechanical improvement of cement.

With the increasing development of self-powered wearable electronic devices, there is a growing interest in thermoelectric generators (TEGs). To achieve more comprehensive and reliable functionality of wearable devices, improving the power generation performance of thermoelectric devices will be the key. It has been shown that integrating a heat sink at the cold end of the TEG increases the effective temperature difference and, thus, maximizes the power output of the thermoelectric device. However, the space left for the power supply is often limited. How to optimize the integrated system of micro-thermoelectric generators and heat sinks in a height-confined space has become the key. In this study, we have established a corresponding model using a numerical calculation method, systematically studied the influence of TEG geometric size on the number of fins and fin height, and determined the optimal number of fins for the highest equivalent convective heat transfer coefficient corresponding to different fin heights. We also conducted the co-design of TEG and fin topological structure to study the effects of the ratio of leg height to fin height (l/H), the width of legs (w), and the number of thermoelectric leg pairs (N) on the maximum output power density per unit area (Pm1) and the maximum output power density per unit mass (Pm2) of the device. When N = 16, w = 0.3 mm, l/H = 2.5 (that is, l = 3.57 mm, H = 1.43 mm), and Pm1 reaches the maximum value of 30.5 μW/cm2; When N = 2, l/H = 0.25 and w = 0.3 mm, and Pm2 reaches a maximum value of 5.12 mW/g. The measured values of the open-circuit voltages of fabricated micro-TEGs with different thermoelectric leg heights (l = 0.49 mm, l = 1.38 mm, and l = 1.88 mm) are basically consistent with the simulated values. When N = 2, l = 0.49 mm, H = 3.74 mm, and w = 0.85 mm, and Pm2 reaches 0.44 mW/g. The results provide insights into the optimal design of wearable micro thermoelectric generator working in a height-confined space and highlight the importance of co-designing TEGs and fin topological structures for optimizing their performance.