We report a fully additive-based electrochemical approach to the site-selective deposition of silver on a polyimide substrate. Using a cathode coated with ion-doped precursor polyimide layers, patterns of metal masks used as anodes were successfully reproduced at the cathode-precursor interface through electrochemical and ion-exchange reactions, which resulted in the generation of silver patterns on the polyimide films after subsequent annealing and removal from the substrate. Excellent interfacial adhesion was achieved through metal nanostructures consisting of interconnecting silver nanoparticles at the metal-polymer interface, which are electrochemically grown "in" the precursor layer. This approach is a resist- and etch-free process and thus provides an effective methodology toward lower-cost and high-throughput microfabrication.

Well-defined one-dimensional arrays of gold nanoparticles dispersed in triphenylphosphine nanowires were obtained by annealing of chloro(triphenylphosphine) gold(I) complexes in a porous alumina template. The obtained nanocomposite wires exhibit strong surface plasmon coupling due to the close proximity of adjacent gold nanoparticles.

One-dimensional (1D) superstructures constructing of inorganic nanoparticles have unique and technologically important potential applications in the areas of nanoelectronics, plasmonics, and molecular sensors. Herein, we describe how nanoporous template and in situ synthetic process can be combined for the construction of composite nanowires consisting of silver nanoparticles dispersed in polymer matrices. We show that, by limiting the space where nanoparticles grow, the silver nanoparticles are encapsulated inward within the polymer nanowires. We also demonstrated that the composite microstructure could be controlled by varying the initial precursor structure, pore size of the template and temperature.

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