No abstract
We have investigated a method for passivation of InSb by vacuum deposition of SiO x on native oxide layers grown by wet anodization. We show that this multilayer dielectric approach results in improved passivation properties. Results of high resolution Auger spectroscopy reveal important information on the layer structure and composition of this passivation film. Specifically, we report the experimental observation ofSi0 2 formation at the SiO x anodic oxide interface. The interfacial reaction is limited to a thin layer, about 10 nm thick. The SiO x oxidation proceeds by reduction of the native oxide and formation of elemental In and Sb. The electrical features observed in the C-V curves (such as flat-band voltage, hysteresis, low-frequency-like response in the inversion region, and other deviations from the ideal curves) are explained in view of the oxidation states of In and Sb, observed at the oxide layers and at their interfaces. These correlations were used for characterization' of the desired interlayer parameters.
Since the late 1990s Semiconductor devices (SCDs) has developed and manufactured a variety of InSb two-dimensional (2D) focal plane arrays (FPAs) that were implemented in many infrared (IR) systems and applications. SCD routinely manufactures both analog and digital InSb FPAs with array formats of 320×256, 480×384, and 640×512 elements, and pitch size in the range 15 to 30 μm. These FPAs are available in many packaging configurations, including fully integrated detector-Dewarcooler-assembly, with either closed-cycle Stirling or open-loop JouleThomson coolers. In response to a need for very high resolution midwave IR (MWIR) detectors and systems, SCD has developed a large format 2D InSb detector with 1280×1024 elements and pixel size of 15 μm. A digital readout integrated circuit (ROIC) is coupled by flip-chip bonding to the megapixel InSb array. The ROIC is fabricated in CMOS 0.18-μm technology, that enables the small pixel circuitry and relatively low power generation at the focal plane. The digital ROIC has an analog to digital (A/D) converter per-channel and allows for full frame readout at a rate of 100 Hz. Such on-chip A/D conversion eliminates the need for several A/D converters with fairly high power consumption at the system level. The digital readout, together with the InSb detector technology, lead to a wide linear dynamic range and low residual nonuniformity, which is stable over a long period of time following a nonuniformity correction procedure. A special Dewar was designed to withstand harsh environmental conditions while minimizing the contribution to the heat load of the detector. The Dewar together with the low power ROIC, enable a megapixel detector with overall low size, weight, and power with respect to comparable large format detectors. A variety of applications with this detector make use of different cold shields with different f-number and spectral filters. In this paper we present actual performance characteristics of the megapixel InSb detector and demonstrate its high manufacturability. C 2011 Society of Photo-Optical Instrumentation Engineers (SPIE).
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