No abstract

Next generation assembly/package development challenges are primarily increased interconnect complexity, density, and multi-layer/multi-stacked packages with ever shorter development time. The results of this trend present some distinct challenges for the analytical tools and techniques to support this technology roadmap. The key challenge in the analytical tools and techniques is the development of nondestructive imaging for improved time to information. The 3D X-ray Computed tomography (CT) system named “X-Tek NGI” has been co-developed by Intel and X-Tek to address this need. The current paper will discuss the configuration and several applications where this tool has been applied successfully to solve current package technology development issues and provide package construction analysis (including enabled components). This paper will discuss the details of the system configuration, examples together with the current limitations and future direction for non-destructive package failure analysis.

Electromigation behavior of solder joints with thick Cu column was studied. The failure mechanisms for both SnPb and SnAg solder joints were discussed. To better understand the mechanisms, voids nucleation and propagation were also studied through Kelvin structure resistant monitoring and cross-sectional in-situ SEM observation. It was observed that package substrate process may play a role on how much portion of the life time that void nucleation and propagation could take respectively. Package warpage also played an important role on electromigration performance.

No abstract