A simple expression for the yield strength of a thin polycrystalline film attached to a substrate and with a passivated layer has been derived from a relationship between stress work for dislocation moving and strain energy. It is shown that, the yield strength of a polycrystalline film is determined by two affecting factors (orientation of grains and type of dislocations) and three strengthening factors (passivated layer strengthening, substrate strengthening, and grainsize strengthening). Predictions from the expression are in agreement with reported experimental results. This shows that the model is reasonable.
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