Electromigration issue caught our attention during a recent effort to design and develop a high current and high current density pulsed power system. At very high current density, a few kA/mm2, the electromigration phenomena will occur. Momentum transfer between electrons and metal atoms at high current density causes electromigration. The reliability and lifetime of pulsed power device can be severely reduced by electromigration. In this paper, we discuss issues such as device reliability model, incubation time of electromigration, lifetime of device, and design tradeoffs.

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