The machining methods such as waterjet cutting, milling, grinding, lapping, etc. are usually used to manufacture glass fiber reinforced composites (GFRCs) parts. Damages will be produced unavoidably in the machining process, no matter which machining method is employed. Subsurface damage is one of the important parameters to evaluate the surface layer damages. The detection method for the subsurface damages of glass fiber reinforced glass matrix (glass/glass) composite after machining is researched. The characteristics of subsurface damages of glass/glass composite after waterjet cutting, milling, grinding and lapping are investigated mainly, when the fiber direction is either perpendicular or parallel to the cutting surface.

Machining the aircraft skin, using CNC milling to replace the traditional chemical milling, is a trend owning to the great pollution of the chemical milling to the environment. Based on the instantaneous rigidity force hypothesis, a milling force model for mirror milling of aircraft skin was proposed, which was validated by the milling force measurement during mirror milling experiments. A FEM model was established to calculate the deformation of the aluminum plate in mirror milling. The effects of the supporting position on the deformation was analyzed.

The origin of drilling force in drilling with twist drill is quite complicated owning to the complex shape of the drill bit cutting edges. In this paper, the drilling experiments both with and without the ultrasonic were designed and conducted on aluminum alloy with pre-drilled hole. The drilling force was tested and the different effects between the cutting edges of the twist drill on the drilling force were analyzed under various drilling parameters including the spindle speed, feed rate and vibration amplitude. The drilling force of conventional drilling (CD) and ultrasonic assisted drilling (UAD) was characterized and the roles of the ultrasonic vibration in drilling were discussed.

Wire saw process is widely used in the machining of hard and brittle materials with low surface damage and high efficiency. Cutting of silicon wafers in integrated circuit (IC), semiconductor and photovoltaic solar industries is also generally using wire saw process. However, the surface layer damage induced by wire saw process will seriously decrease the wafer quality and increase the process time and production costs of the post grinding and polishing. The surface layer qualities of the silicon wafers sawed by the different wire saw processes was investigated in this paper. The characteristics of surface roughness, surface topography and subsurface damage of silicon wafers sliced by the fixed abrasive and the loose abrasive wire sawing respectively were compared and the corresponding reasons were analyzed.

Titanium alloy has been widely used in aeronautics and astronautics industry owing to its unique combinations of properties. The unique physical and chemical properties of titanium alloy make it a typical difficult-to-machine material. The elevated temperatures at the machining zones may cause thermal damage, residual stress and micro-structural changes in the surface layer of titanium alloy during grinding. In this study, grinding experiments were performed on the titanium alloy, and the grinding temperature was experimentally tested with the grindable thermocouples. The effects of the grinding parameters on the grinding temperature were analyzed. The grinding temperature rises with the increase of grinding speed and grinding depth.