During service, microcracks form inside solder joints, making microelectronic packages highly prone to failure on dropping. Hence, the fracture behavior of solder joints under drop conditions at high strain rates and under mixed-mode conditions is a critically important design consideration for robust joints. This study reports on the effects of joint processing and loading conditions on the microstructure and fracture response of Sn-3.8%Ag-0.7%Cu (SAC387) solder joints attached to Cu substrates. The impact of parameters which control the microstructure (reflow condition, aging) as well as loading conditions (strain rate and loading angle) are explicitly studied. A methodology based on the calculation of the critical energy release rate, G C , using compact mixed-mode (CMM) samples was developed to quantify the fracture toughness of the joints under conditions of adhesive (i.e., interface-related) fracture. In general, higher strain rate and increased mode-mixity resulted in decreased G C . G C also decreased with increasing dwell time at reflow temperature, which produced a thicker intermetallic layer at the solder-substrate interface. Softer solders, produced by slower cooling following reflow, or post-reflow aging, showed enhanced G C . The sensitivity of the fracture toughness to all of the aforementioned parameters reduced with an increase in the mode-mixity. Fracture mechanisms, elucidating the effects of the loading conditions and process parameters, are briefly highlighted.
In this study, we have synthesized highly photoluminescent TiO2/poly (phenylene vinylene) (PPV) hybrid nanoparticle‐polymer fibers by electrospinning a PPV precursor added to a TiO2 sol‐gel solution. The diameters of the hybrid fibers ranged from 100–300 nm and the average size of TiO2 nanoparticles within the fibers was 10–60 nm. FT‐IR analysis indicated that a new band around 1 632 cm−1 assigned to the TiOC vibration appeared, which resulted in the stronger luminance of the fluorescence of the TiO2/PPV hybrid fibers compared to free standing PPV nanofibers.
As a subseries of the covalent organic framework (COF) material family, polyimide-based covalent organic framework (PI-COF) material, which has the advantages of high stability of polyimide, high specific surface area, and controllable pores of COF material, is expected to be a new type of porous material with potential applications. Although the development of PI-COF is in the early stages during the past decade, it has attracted extensive attention and is widely used in heterogeneous catalysis, gas separation, and storage fields. Therefore, this review is aiming to give a comprehensive understanding of the recent progress of PI-COFs. This article summarizes the progress of PI-COF from three aspects: controllable structure design, synthesis method, and application. First of all, under the guidance of network chemical design principles, the topology type of PI-COF and the size and shape of the formed pores are summarized in terms of different organic monomers. Then the five synthetic strategies for the synthesis of PI-COF are analyzed. Finally, the applications of PI-COF in adsorption and separation, drug delivery, solar-to-electrochemical energy storage, photocatalysis, and electrocatalyst are introduced.
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