2014 IEEE 26th International Symposium on Power Semiconductor Devices &Amp; IC's (ISPSD) 2014
DOI: 10.1109/ispsd.2014.6856035
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1.2kV class SiC MOSFETs with improved performance over wide operating temperature

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Cited by 21 publications
(9 citation statements)
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“…However, the wider bandgap of SiC makes it highly unlikely for the activation of the parasitic BJT element during typical UIS events (i.e., with typical values of switched currents and ensuing temperature evolution). Previous publications have shown that commercially available SiC MOSFETs exhibit significant intrinsic avalanche ruggedness and could dissipate E AV above 1 J, depending on the test conditions [5][6][7]13,14]. Even though different studies have presented experimental avalanche robustness, the understanding of its failure mechanism stills remains somewhat unclear and lacking.…”
Section: Introductionmentioning
confidence: 99%
“…However, the wider bandgap of SiC makes it highly unlikely for the activation of the parasitic BJT element during typical UIS events (i.e., with typical values of switched currents and ensuing temperature evolution). Previous publications have shown that commercially available SiC MOSFETs exhibit significant intrinsic avalanche ruggedness and could dissipate E AV above 1 J, depending on the test conditions [5][6][7]13,14]. Even though different studies have presented experimental avalanche robustness, the understanding of its failure mechanism stills remains somewhat unclear and lacking.…”
Section: Introductionmentioning
confidence: 99%
“…The recent advances at GE and elsewhere have cleared the path for widespread adoption of SiC devices in power conversion applications. Such achievements include: Schottky diode product introductions by Infineon and Cree [4,5] validated commercial feasibility of material; qualification testing of GE MOSFETs [6] in accordance with the most stringent automotive standard AEC-Q101 [7] has shown that the devices meet survivability and parametric stability requirements at operating temperature of 200 o C. Additionally, the risk of bipolar degradation of SiC MOSFET body diode was mitigated through material quality improvement [8,9] or by limiting device body diode SOA to high frequencies and short forward conduction durations [10]. It is, therefore, expected that MOSFET will become the SiC device of choice for high power industrial applications by offering superior performance and reliable, cost competitive system solutions.…”
Section: Introductionmentioning
confidence: 99%
“…Discrete SiC-MOSFETs have been developed and commercialized by many companies for intermediate-voltage classes from 600 V to 2 kV. [17][18][19][20][21][22] On the other hand, high-voltage (>3 kV) SiC-MOSFETs have so far been under development by several research groups. [23][24][25] In the field of handling high-voltage and high-frequency systems such as high-power trains, SiC-MOSFETs show potential for low switching losses while exhibiting conduction losses comparable to those of conventional Si-IGBTs if the cell structural design is optimized.…”
Section: Introductionmentioning
confidence: 99%